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Compact Rugged Mission Control System

SIU36 DATA SHEET

INTRODUCTION

North Atlantic Industries' (NAI) Sensor Interface Unit (SIU36) is a rugged base-plate conduction-cooled or air/convection cooled chassis that leverages and integrates NAI’s Configurable Open Systems Architecture™ (COSA ®) rugged conduction-cooled 3U OpenVPX SBC, multifunction I/O boards and power supply products. The SIU36 provides a compact, high density, processing & graphics capable data distribution system solution for I/O intensive, mission or control systems applications. The SIU36 supports board-level processing and full I/O control and communication over Ethernet. With local processing, MIL-STD-1553, ARINC 429/575, Serial or ARINC 825 CAN bus are also available as primary communications interfaces when the boards are configured as such. PowerPC, Intel® or ARM Single Board Computer (SBC) processors can be added for a complete processing and I/O solution. The SIU36 is designed to support up to six NAI multi-function pre-configurable SBC/multifunction I/O boards, with or without processing, that support a wide variety of interface and communications smart function modules, all fitted/housed in a single rugged multi-board slot SIU system chassis, which is “delivered” pre-integrated and fully tested as a system.

OBJECTIVES

This manual provides the user with basic hardware implementation and information regarding the operation and interface of the SIU36. Each SIU36 is fitted with either one to six 3U OpenVPX boards and a single mil-standard power supply unit. Additional PSU option for “hold-up” power/time is available.

SCOPE

This manual only covers the operation of the SIU36 as a stand-alone I/O subsystem. This manual does not cover specific details relating to the operation of the specific I/O boards and function module fitted within the SIU36. Please reference the board specific documentation for details regarding the board level configuration(s).

CONVENTIONS USED IN THIS MANUAL

WARNINGS, CAUTIONS, and NOTES

Note	An operating procedure, practice, or condition, etc., that is essential to emphasize. All numbers are expressed in decimal format unless otherwise noted.

NOTE An operating procedure, practice, or condition, etc., that is essential to emphasize.

All numbers are expressed in decimal format unless otherwise noted.

GENERAL SAFETY NOTICES

The following general safety notices supplement the specific warnings and cautions appearing elsewhere in the manual. They are recommended precautions that must be understood and applied during operation and maintenance of the instrument covered herein.

Serious injury may result if personnel fail to observe safety precautions. Dependent on configuration, some modules (e.g. Synchro / Resolver or AC signal sources) can generate output signals with high voltages. Be careful not to contact high-voltage connections when installing, operating or maintaining this instrument.

The SIU36 is delivered as a standalone system with no accessible or serviceable parts.

REPAIR

DO NOT ATTEMPT REPAIR. Under no circumstances should repair of this instrument be attempted. All repairs to this chassis must be accomplished at the factory.

HIGH VOLTAGE

HIGH VOLTAGE may be used in the operation of this equipment.

INPUT POWER ALWAYS ON

Note	The design of the model SIU36 is such that input power is continuously supplied to internal circuits when connected to a main power source. To disconnect the SIU34S from external power, the external power source should first be de-energized. The power input cable can then be disconnected.

Website https://www.naii.com/

SYSTEM SPECIFICATIONS AND DETAILS

Introduction

The model SIU36 is a next generation rugged systems chassis joining the NAI Sensor Interface Unit (SIU) system chassis family pedigree. The SIU36 is configured to support a wide variety of SBC and multifunction I/O boards that can be configured to support a variety of processing, communications and I/O functions that are supported under the NAI Configurable Open Systems Architecture ™ (COSA®) product families.

The SIU36 can function either as a centralized or distributed system. It can also be used to supplement existing legacy systems by easily adding sensor data acquisition as well as general I/O and communication interfaces without expensive legacy chassis and backplane redesign. It has been designed with rugged embedded industrial, military and aerospace applications in mind.

Leveraging NAI’s field-proven, unique modular architecture, the SIU36 supports standard 3U OpenVPX board-level compatible boards that can be fitted with a wide selection of different Intelligent I/O, motion simulation/measurement and communications functions such as:

A/D Converter

D/A Converter

I/O TTL/CMOS

RTD

I/O Discrete

I/O Differential Transceiver

Synchro/Resolver LVDT/RVDT Measurement

Synchro/Resolver LVDT/RVDT Simulation

Strain Gauge

Encoder

Dual-Channel Dual Redundant BC/RT/MT MIL-STD-1553

High-Speed Sync/Async RS232/422/423/485

ARINC 429/575

CAN bus

I/O Relay

This approach provides unprecedented flexibility for supporting existing or new applications where there are specific interfacing requirements. Significant application benefits include:

Independent (pre-processed) I/O functionality targeted to specific data acquisition/control areas
Additional capabilities, technology insertion and sensor interfacing to existing fielded applications
Minimal integration risk based on current field-proven, deployed technologies

Specifications

The SIU36 is designed to meet the following general product specifications and is provided as a reference. Actual configuration and usage may affect size, weight and power (SWaP) specifications. Please contact NAI for discerning/defining SWaP considerations regarding specific program configurations. See additional details herein.

General

Table 1. SIU36 General SWaP Specifications
Input Voltage:	Standard/Default: DC: 18 to 36 VDC (28 VDC nominal)
Power (Base unit):	~10 W (PSU efficiency, at 100W load) @ 28 VDC nominal Then, add the power calculated for the configuration specific boards module(s) power (see separate specific boards and module(s) specifications). I/O Signal GND reference is isolated from main power source return and chassis.
Power/Heat Dissipation:	Conduction Cooled (CC): ~150 watts (maximum) when properly mounted to a cold plate, which must be maintained at a temperature not to exceed 71°C. Air/Convection cooled (AC) Contact/consult with NAI for configuration and power dissipation. SIU Air/Convection version maximum power dissipation is dependent, but not limited to, configuration, power dissipation, air flow, program and other environmental considerations. NOTE: The total SIU36 power dissipation is dependent on the configuration of the boards and function module types fitted in the SIU36. Environmental and other operating characteristic variable considerations should be considered.
Temperature, Operating:	-40°C to 71°C Conduction cooled: As measured at primary thermal transfer interface. Air/Convection cooled: Air/ambient temp as specified.
Temperature, Storage:	-55°C to 105°C
Size:	Height: ~5.0” (127 mm) CC or ~6.4” (163 mm) AC (w/ additional heat dissipator fin height) Depth: ~9.5” (241 mm) Width: ~9.0” (229 mm)
Weight:	The weight of an SIU36 system is dependent on the configuration. The approximate weight of the SIU36 is based on the selection of the PSU, boards and functional module(s). The approximate weight of a configured SIU36 is: ~13.2¹ lbs. unpopulated Chassis/backplane/rigid flex & connector boards/PSU (conduction cooled) ~14.4¹ lbs. unpopulated Chassis/backplane/rigid flex & connector boards/PSU (air/convection cooled) (¹ includes ~2.2 lbs. for PSU) ~21.3² lbs. fully populated (conduction cooled) ~22.5² lbs. fully populated (air/convection cooled) (² includes ~1.35 lbs. for each additional fully function module populated board)

UNPACKING AND INSPECTION

Unpacking

The SIU36 packing materials were designed specifically for transport protection of the SIU36. When receiving the shipment container, inspect packaging for any evidence of physical damage. If damage is evident, it is recommended that the carrier agent is present when opening the shipping container. It is further recommended that all packing material is retained in the event the SIU36 needs to be shipped elsewhere.

System/Chassis Identification

An identification label, indicating part number, unique serial number and Ethernet PHY MACs / default IP address(es) is affixed to the system chassis.

Figure 1. SIU36 Unit Identification Label Location

Label information provided:

Unit Level Part Number

Unit Level Serial Number

Unit Level Date Code

Also, typically provided with:

Slot/Board configuration(s) as applicable

Slot/Board serial numbers and D/C

Slot/Board IP address / MAC address (if applicable)

Special labeling requirements are also considered (i.e. UID matrix, customer part number, etc.). Contact factory for special labeling requirements.

Inspection

Inspect the chassis and connectors to ensure that they were not damaged during transit.

MECHANICAL INTERFACE

Mechanical Description

The standard SIU36 is a rugged milled 6061 aerospace grade aluminum alloy stock. Conduction cooled version is expected to be mounted to a thermally conductive surface to maintain the specified temperature. The system thermal management design considerations should ensure that the chassis thermal interface (SIU36 bottom surface) does not exceed 71°C. Mounting holes are provided on the chassis bottom housing flanges (as depicted).

The SIU36 is also available in an air/convection cooled version. This version is built with integrated cooling fins milled into the primary chassis housing. Air/convection cooled version must maintain the chassis temperatures at the specified temperature (operational and environmental consideration variables include, but are not limited to chassis configuration power dissipation, air temperature and air flow available.

Maximum power and heat dissipation are dependent on the board and function compliment chosen. Contact NAI for application guidance. See the reference outline drawing(s) below.

Mounting Requirements

Conduction Cooled

Refer to SIU36 Outline and Installation Drawing (OID) for details on mounting and installing the SIU36. It is available for download from NAI’s website (NOTE: availability pending, contact factory for mounting/installation details). The SIU36 is conduction cooled and must be mounted in accordance with the drawing. The OID provides recommended hardware, torque, cold-plate flatness and surface finish specifications, and thermal conductivity requirements.

Figure 2. SIU36 Conduction Cooled Outline Dimensions & Mounting Pattern (Reference Only)

Air/Convection Cooled

Refer to SIU36 Outline and Installation Drawing (OID) for details on mounting and installing the SIU36. It is available for download from NAI’s website. The SIU36 is conduction cooled and must be mounted in accordance with the drawing. The OID provides recommended hardware, torque, cold-plate flatness and surface finish specifications, and thermal conductivity requirements.

Figure 3. SIU36 Air Cooled Outline Dimensions & Mounting Pattern (Reference Only)

Chassis (Earth) GND

Chassis ground point threaded insert location is on the connector face (front) of the SIU36 as shown.

Conduction cooled as shown, but air/convection version GND point is in similar location.

Figure 4. SIU36 Outline Dimensions/Chassis GND location

NOTE:

A Chassis GND braid or equivalent is expected to be secured by the following hardware or equivalent (delivered/installed with the SIU36 assembly):

SCREW, SOCKET HEAD CAP, 8-32, ½” LONG, 18-8 SS
Lock Washer, #8, 0.174" ID, 0.293" OD, 18-8 SS
Flat Washer, #8, 0.172" ID, 0.375" OD, 18-8 SS

Securing information:

The chassis is designed/built with a helical insert: NAS1130-08-15 or equivalent (8-32 Helical Insert, 0.246" Length, 18-8 Stainless Steel)
Maximum screw/insert hole depth is 0.4”
Recommended torque for the SIU36 Chassis GND screw: 15 in-lbs. (170 N-cm)

Finish

Unless otherwise specified, the following standard finish, or equivalent per NAI process requirements applies:

PRE-TREATMENT: CHEMICAL FILM COATING IAW MIL-DTL-5541, TYPE II, CLASS 3, ALL OVER.
PAINT PRIMER COAT: IAW-MIL-PRF-23377, TYPE II, CLASS 2, WITH A 0.9MIL MINIMUM DRY FILM THICKNESS TO EXTERIOR SURFACES SHOWN IN PAINT MASKING FIGURES.
PAINT FINISH COAT: APPLY MEDIUM TEXTURE USING PER MIL-PRF-85285, TYPE I, CLASS 2, SEMI-GLOSS BLACK WITH A DRY FILM THICKNESS OF 0.0008 TO 0.0012 TO EXTERIOR SURFACES.
FINISH NOTES 2 AND 3 OMITTED FROM THERMAL INTERFACE SURFACE INDICATED & FROM ALL HARDWARE.

CONNECTOR DESIGNATIONS, LOCATIONS & DESCRIPTIONS

The Power, I/O Interface and Ethernet connectors are located on the SIU36 front panel housing.

Conduction cooled as shown, but air/convection version GND point is in similar location.

Figure 5. SIU36 (Front Panel Connector Placement)

Table 2. SIU36 Connector Designation and Description
REF. DES.	KEY	MANUFACTURER / MIL-DTL SPEC. (or Equiv.)	P/N	MATE P/N
J1	N	AMPHENOL	TVP02RF-151SN(S2AD	TV06RF-23-151PN
J2	A	AMPHENOL	TVP02RF-151SA(S2AD	TV06RF-23-151PA
J3	D	AMPHENOL	TVP02RF-151SD(S2AD)	TV06RF-23-151PD
J4	B	AMPHENOL	TVP02RF-151SB(S2AD)	TV06RF-23-151PB
J5	E	AMPHENOL	TVP02RF-151SE(S2AD)	TV06RF-23-151PE
J6	C	AMPHENOL	TVP02RF-151SC(S2AD)	TV06RF-23-151PC
J7	B	MIL-DTL-D38999 Type	D38999/20FB35PN	D38999/26WB35SN

CONNECTOR DETAILS AND PINOUTS

Generic pinout. See module I/O section or contact factory regarding any special module I/O configuration.

J7, Primary Power Connector

Primary input power is supported on the SIU36 via the J7 connector. Power input for the SIU36: 28 VDC (standard, default).

28 VDC Input Connector

Part Number: TVP02RW-11-35PN, (w/ 10,000 pf conn filtering)

Equivalent to MIL-DTL-D38999 Series III and insert arrangement IAW MIL-STD-1560: Shell size 11-35 (Insert 35), “N” (Normal) key, 13 pins.

Figure 6. 28 VDC Pin Insert Arrangement, Front View

CONNECTOR DETAILS AND PINOUTS

I/O Connectors (J1 to J6) and SLOT Designations

Connectors J1 to J6 route all the I/O from the six OpenVPX boards within the SIU36. The I/O pins from the boards (user defined, and factory configured) are designated from the 3U board slot locations. The Slot-X P1 and P2 connectors of the OpenVPX cards are routed through the backplane to the SIU36 front panel connector rigid-flex assemblies. The specific I/O pin-out information for the J1 to J6 is defined by the configuration of the OpenVPX boards and function modules fitted to the OpenVPX boards.

Jx Designation

SIU34 Connector MFG. P/N (or equivalent)

Board #

NAI Conn P/N

TVP02RF-23-151S(S2AD)

Slot-1

05-0473-COM

TVP02RF-23-151SA(S2AD)

Slot-2

05-0468-COM

TVP02RF-23-151SD(S2AD)

Slot-3

05-0471-COM

TVP02RF-23-151SB(S2AD)

Slot-4

05-0469-COM

TVP02RF-23-151SE(S2AD)

Slot-5

05-0472-COM

TVP02RF-23-151SC(S2AD)

Slot-6

05-0470-COM

(J7)

(D38999/20FB35PN)

[ PSU (Slot-5) ]

(05-0509-COM)

Figure 7. SIU36 Slot and Connector Association Details

Mating Connector Information

Mating Connector Kit; NAI P/N: SIU36-CONN-KIT

Available as an optional separate line item. The mating connector kit includes 1 each (or equivalent):

J1 Mate

NAI P/N: 05-0480-COM

HD38999 Type III / TV06RF23-151PN / EN, 151-pin, N-Key

J2 Mate

NAI P/N : 05-0475-COM

HD38999 Type III / TV06RF23-151PA / EN, 151-pin, A-Key

J3 Mate

NAI P/N : 05-0478-COM

HD38999 Type III / TV06RF23-151PD / EN, 151-pin, D-Key

J4 Mate

NAI P/N: 05-0476-COM

HD38999 Type III / TV06RF23-151PB / EN, 151-pin, B-Key

J5 Mate

NAI P/N : 05-0479-COM

HD38999 Type III / TV06RF23-151PE / EN, 151-pin, E-Key

J6 Mate

NAI P/N: 05-0477-COM

HD38999 Type III / TV06RF23-151PC / EN, 151-pin, C-Key

J5 Mate

NAI P/N : 05-0289-COM

D38999/26WB35SN / OD, 13-pin, N-Key

POWER-UP AND BASIC OPERATIONS

Panel LEDs & Functions

Front Panel Power & Status LED Indicators

Figure 8. SIU36 Status LEDs Location

Table 3. SIU36 Status LEDs Function
LED	STATUS / FUNCTION
LED	ILLUMINATED	EXTINGUISHED
POWER GRN	Blinking: Initializing Steady On: Power-On/Ready	Power-off
* STATUS RED	Module BIT (Attention required)	No Module BIT Attention Required

*Status LED operations: Unless otherwise specified, default Status LED operations is controlled by the Slot-1 SBC/Root Complex card over the internal I²C communications link and functionally defined by the customer applied software application.

Elapsed Time Counter (ETC)

Integrated within the SIU36 backplane is an Elapsed Time Counter (ETC) IC, which records the accumulated time that the elapsed time recorder’s Event pin has been held high (in 250 ms increments). The ETC is stored on the chip from registers 0x0A-0x0D and read by the Slot-1 SBC/Root Complex card over the internal I2C communications link (the register is 0x6B).

Basic Operations

The SIU36 is delivered as a tested unit. All pins and operation have been verified. It is recommended that Power and Ethernet connections be made to verify operation of the boards fitted within the SIU36 by making use of NAI’s Embedded Soft Panel based GUI sample application that can be utilized as a board level “exercising” tool (if the SIU36 card configuration supports). The example process below describes the use of NAI’s Ethernet communications software tool.

After applying appropriate power to the SIU36, connect a host computer (laptop or similar running Windows XX (or Linux), to the appropriate Ethernet enabled/configured board (configured/populated in slot 1) Port A or Port B. The selection of Ethernet Port A or B is dependent on Slot-1 OpenVPX board configuration.

Note	Ethernet port assignments, MAC address, and factory default IP address are indicated on the chassis label.

For detailed supplement, please visit the NAI web-site specific product page(s).

QUALIFICATION

The SIU36 has been designed to meet the following general specifications. Cooling type, size, weight, power and environmental characteristics may affect the program requirements and the specifications as applied. Contact factory for the SIU36 Qualification Test status.

Environmental

Table 4. Environmental Qualification Testing Specifications
Environmental MIL-STD-810 (¹) (unless otherwise specified)
No.	Description	Procedure	Cycles	Table	Figure	Comments
514	Random Vibe					Method 514.6, 0.1g²/Hz from 100 to 1K Hz., -3dB octave 5-100 Hz and -6dB 1K-2K Hz,(operational)
514	Sinusoidal Vibe					TBD
501	Temp (High)		3			3 periods (@ 4 hrs. ea.) within 24 hrs. cycle at 71 ºC baseplate
502	Temp (Low)		1			3 periods (@ 4 hrs. ea.) within 24 hrs. cycle at -40 ºC baseplate
503	Temp (Shock)		3			3 x 1 hr. each hot & cold cycle
507	Humidity	II	10	507.5-7	507.5-IX	Cyclic high humidity (Cycle B2)
500	Altitude (50K)	II	1	n/a	n/a	10m/s to 50,000ft for 1 hr.
513	Acceleration	II	1	513.6-II	n/a	Carrier-based Aircraft (18g’s max)
516	Shock - Operating	I	3	516.6-I	n/a	40g’s, 1 min each x 6 axis
516	Shock - Crash	V	3	516.6-I	n/a	75g’s, 1 min each x 6 axis
Ingress Protection IEC 60529 (¹, ²)
No.	Description	Procedure	Cycles	Table	Figure	Comments
IP54	Dust Protection					(other – pending characterization / contact factory)
IP54	Water Splashing					(other – pending characterization / contact factory)
IP65	Dust Tight					(other – pending characterization / contact factory)
IP65	Water Jets					(other – pending characterization / contact factory)

EMI/EMC Specifications

Table 5. EMI/EMC Qualification Testing Specifications
EMC / MIL-STD-461 (¹, ²*) (unless otherwise specified)**
MIL-STD-461F	Method/Curve/Procedure	Comments
CE102	Conducted, Emissions, Power Leads, 10K - 10M Hz
CS101	Conducted, Susceptibility, Power Leads, 30 - 150K Hz
CS106	Conducted, Susceptibility, Power Leads
CS114	Conducted, Susceptibility, Power Leads, 10K - 10M Hz
CS115	Conducted, Susceptibility, Bulk Injection
CS116	Conducted, Susceptibility, SIN Transient 10K - 100M Hz
RE101	Radiated, Emissions, Magnetic Field, 30 - 100K Hz
RE102	Radiated, Emissions, Electric Field, 10K - 1.25G Hz
RS101	Radiated, Susceptibility, Magnetic Field, 30 - 100K Hz
RS103	Radiated, Susceptibility, Electric Field, 2M - 18G Hz

Notes:

*1 - Designed to meet / Generic Test Reports Available

*2 - Utilizing proper shielded cables and system grounding practices

HEAT DISSIPATION

The SIU36 is capable of dissipating up to a total of 150 Watts when properly mounted. Generally, the conduction cooled version thermal interface or the air/convection cooled version chassis must be maintained at a temperature not to exceed 71°C. Other operating and environmental factors and variable must be considered when specifying for a higher-level system platform integration. The total SIU36 power dissipation is dependent on the configuration of the OpenVPX boards and power supply fitted in the SIU36.

RELIABILITY

The reliability of the SIU36 is dependent on the configuration of the OpenVPX boards and power supply fitted within it. The Mean Time between Failures listed below is for the SIU36 configured with chassis, backplane, EMI Filter and connectors.

MTBF

The Mean Time between Failures is configuration, environment and temperature dependent. Please contact factory regarding calculations based on the specific configuration and program requirements.

REF

Description

Calculation Model

MTBF* (hours)

Environment

Temp (°C)

SIU36 - BP/FLT

SIU36 Chassis/backplane/filter assembly

MIL-HDBK-217FN2 and ANSI/VITA 51.0 & 51.1-2008. RELIABILITY PREDICTION SUBSIDIARY SPECIFICATION

657,336

AIC

516,765

322,651

*Calculation estimate only (to be validated)

SIGNAL PIN-OUTS

The following pinouts provides a general use guideline as an example, only. Pinout routing will be dependent on card type/configuration for optimal I/O usage. Consult NAI factory for assistance in determining specific configuration signal definitions as applicable.

Pin-Out / General / I/O Connector (Slot 1)

The following pinout is an example of a SIU36 Slot-1 populated with a 68PPC2 SBC fitted with an EM1, high-speed I/O 2-port Ethernet NIC and a CM5, combination 2-Channel dual redundant MIL-STD-1553 and 8-Channel ARINC 429 communications function modules.

J1 D38999 Connector

68PPC2 (as configured)

BP Pin

BP Signal Name

MOD-1 / EM1

MOD-2 / CM5

Signal Description

TX2-TP2P

J1-A13

TX2-TP2P

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

TX2-TP2N

J1-B13

TX2-TP2N

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

TX2-TP3P

J1-E13

TX2-TP3P

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

TX2-TP3N

J1-F13

TX2-TP3N

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair

TX1-TP3P

J1-G14

TX1-TP3P

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

TX1-TP3N

J1-H14

TX1-TP3N

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

MOD2-DATIO06

J2-B11

MOD2-DATIO06

CH1-RT-ADDR3/ANN1

MIL-STD-1553, Discrete RT Addressing, GND/OPEN

MOD2-DATIO11

J2-G12

MOD2-DATIO1

CH1-STANDARD/BNP1

MIL-STD-1553, Discrete Special Mode Select, GND/OPEN

MOD2-DATIO12

J2-H12

MOD2-DATIO12

CH1-MODE0/BNN1

MIL-STD-1553, Discrete Special Mode Select, GND/OPEN

USB3_SSRXP_DN1

J1-G12

USB3_SSRXP_DN1

LV-Differential, ~ 600 mV, pk-pk

USB3_SSRXN_DN1

J1-H12

USB3_SSRXN_DN

LV-Differential, ~ 600 mV, pk-pk

MOD2-DATIO04

J2-H10

MOD2-DATIO04

BUSBN-CH1

MIL-STD-1553, BUS, 24Vp-p (typ)

MOD2-DATIO03

J2-G10

MOD2-DATIO03

BUSBP-CH1

MIL-STD-1553, BUS, 24Vp-p (typ)

TTL-CH1

J2-I01

P2-G1

TTL, 0-5V, GND REF

TTL-CH2

J2-I03

P2-G3

TTL, 0-5V, GND REF

MOD2-DATIO05

J2-A11

MOD2-DATIO05

CH1-RT-ADDR2/ANP1

MIL-STD-1553, Discrete RT Addressing, GND/OPEN

+5V-USB3_2

J1-G10

+5V-USB3_2

5V, 0.5A max (pending)

GND

GND Reference (signal/system GND)

SER-GND2

J1-I13

SER-GND2

GND Reference (signal/system GND)

USB3_SSRXP_DN2

J1-E09

USB3_SSRXP_DN2

LV-Differential, ~ 600 mV, pk-pk

USB3_SSRXN_DN2

J1-F09

USB3_SSRXN_DN2

LV-Differential, ~ 600 mV, pk-pk

TTL-CH4

J2-I07

P2-G7

TTL, 0-5V, GND REF

TTL-CH3

J2-I05

P2-G5

TTL, 0-5V, GND REF

MOD2-DATIO16

J2-F13

MOD2-DATIO16

AR429-B-CH02

±10V, Bipolar, Return-to-Zero (RZ)

MOD2-DATIO15

J2-E13

MOD2-DATIO15

AR429-A-CH02

±10V, Bipolar, Return-to-Zero (RZ)

N/C

n/c

N/C

n/c

USB3-2_GND

J1-H10

USB3-2_GND

GND Reference (signal/system GND)

N/C

n/c

N/C

n/c

(high speed)

J2-E05

MOD1-ETH3-TP0P

Shield

Shield drain, cable, GbE (EM1)

(high speed)

J2-F05

MOD1-ETH3-TP0N

(n/c)

N/A

+5V-USB3_1

J1-E11

+5V-USB3_1

5V, 0.5A max (pending)

USB3-1_GND

J1-F11

USB3-1_GND

GND Reference (signal/system GND)

MOD2-DATIO28

J2-H16

MOD2-DATIO28

CH1-RT-PARITY/BPN1

MIL-STD-1553, Discrete RT Addressing, GND/OPEN

MOD2-DATIO27

J2-G16

MOD2-DATIO27

CH1-RT-ADDR4/BPP1

MIL-STD-1553, Discrete RT Addressing, GND/OPEN

N/C

n/c

N/C

n/c

N/C

n/c

MOD2-DATIO31

J2-I11

MOD2-DATIO31

AR429-A-CH07

±10V, Bipolar, Return-to-Zero (RZ)

MOD2-DATIO23

J2-E15

MOD2-DATIO23

AR429-A-CH08

±10V, Bipolar, Return-to-Zero (RZ)

MOD2-DATIO24

J2-F15

MOD2-DATIO24

AR429-B-CH08

±10V, Bipolar, Return-to-Zero (RZ)

(high speed)

J2-H04

MOD1-ETH3-TP2N

(n/c)

N/A

(high speed)

J2-G04

MOD1-ETH3-TP2P

(n/c)

N/A

MOD2-DATIO18

J2-D14

MOD2-DATIO18

AR429-B-CH04

±10V, Bipolar, Return-to-Zero (RZ)

MOD2-DATIO17

J2-C14

MOD2-DATIO17

AR429-A-CH04

±10V, Bipolar, Return-to-Zero (RZ)

MOD2-DATIO19

J2-G14

MOD2-DATIO19

AR429-A-CH05

±10V, Bipolar, Return-to-Zero (RZ)

MOD2-DATIO20

J2-H14

MOD2-DATIO20

AR429-B-CH05

±10V, Bipolar, Return-to-Zero (RZ)

GND

GND Reference (signal/system GND)

N/C

n/c

N/C

n/c

MOD2-DATIO32

J2-I09

MOD2-DATIO32

AR429-B-CH07 ±10V, Bipolar,

Return-to-Zero (RZ)

(high speed)

J2-F09

MOD1-DATIO02

EM1-ETH2-TP0-

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

(high speed)

J2-E09

MOD1-DATIO01

EM1-ETH2-TP0+

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

GND

GND Reference (signal/system GND)

(high speed)

J2-F03

MOD1-ETH4-TP0N

(n/c)

N/A

(high speed)

J2-E03

MOD1-ETH4-TP0P

(n/c)

N/A

USB3_2N

J1-D10

USB3_2N

LV-Differential, ~ 600 mV, pk-pk

USB3_2P

J1-C10

USB3_2P

LV-Differential, ~ 600 mV, pk-pk

MOD2-DATIO26

J2-D16

MOD2-DATIO26

CH1-RT-ADDR1/APN1

MIL-STD-1553, Discrete RT Addressing, GND/OPEN

MOD2-DATIO25

J2-C16

MOD2-DATIO25

CH1-RT-ADDR0/APP1

MIL-STD-1553, Discrete RT Addressing, GND/OPEN

N/C

n/c

N/C

n/c

N/C

n/c

GND

GND Reference (signal/system GND)

N/C

n/c

N/C

n/c

(high speed)

J2-H02

MOD1-ETH4-TP2N

(n/c)

N/A

(high speed)

J2-G02

MOD1-ETH4-TP2P

(n/c)

N/A

USB3_SSTXN_DN1

J1-D12

USB3_SSTXN_DN1

LV-Differential, ~ 600 mV, pk-pk

USB3_SSTXP_DN1

J1-C12

USB3_SSTXP_DN1

LV-Differential, ~ 600 mV, pk-pk

MOD2-DATIO13

J2-A13

MOD2-DATIO13

AR429-A-CH01

±10V, Bipolar, Return-to-Zero (RZ)

MOD2-DATIO09

J2-C12

MOD2-DATIO09

BUSBP-CH2

MIL-STD-1553, BUS, 24Vp-p (typ)

MOD2-DATIO10

J2-D12

MOD2-DATIO10

BUSBN-CH2

MIL-STD-1553, BUS, 24Vp-p (typ)

N/C

n/c

N/C

n/c

NVMRO

J1-I01

N/C (P1-Res_Bus_SE)

NVMRO (Write_Enable#), Open/GND

N/C

n/c

GND

GND Reference (signal/system GND)

N/C

n/c

BKPLN-SATA-TXP

J2-E01

BKPLN-SATA-TXP

LVDS, ~ 250 mV, pk-pk (pending)

BKPLN-SATA-TXN

J2-F01

BKPLN-SATA-TXN

LVDS, ~ 250 mV, pk-pk (pending)

USB3_SSTXN_DN2

J1-B09

USB3_SSTXN_DN2

LV-Differential, ~ 600 mV, pk-pk

USB3_SSTXP_DN2

J1-A09

USB3_SSTXP_DN2

LV-Differential, ~ 600 mV, pk-pk

MOD2-DATIO14

J2-B13

MOD2-DATIO14

AR429-B-CH01

±10V, Bipolar Return-to-Zero (RZ)

GND

GND Reference (signal/system GND)

N/C

n/c

N/C

n/c

N/C

n/c

N/C

n/c

N/C

n/c

N/C

n/c

N/C

n/c

(high speed)

J2-A07

MOD1-DATIO11

EM1-ETH1-TP1+

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

USB3_1N

J1-B11

USB3_1N

LV-Differential, ~ 600 mV, pk-pk

USB3_1P

J1-A11

USB3_1P

LV-Differential, ~ 600 mV, pk-pk

MOD2-DATIO21

J2-A15

MOD2-DATIO21

AR429-A-CH06

±10V, Bipolar, Return-to-Zero (RZ)

MOD2-DATIO22

J2-B15

MOD2-DATIO22

AR429-B-CH06

±10V, Bipolar, Return-to-Zero (RZ)

N/C

n/c

100

N/C

n/c

101

N/C

n/c

102

N/C

n/c

103

(high speed)

J2-D08

MOD1-DATIO08

EM1-ETH2-TP3-

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

104

(high speed)

J2-C08

MOD1-DATIO07

EM1-ETH2-TP3+

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

105

MOD2-DATIO02

J2-D10

MOD2-DATIO02

BUSAN-CH1

MIL-STD-1553, BUS, 24Vp-p (typ)

106

MOD2-DATIO01

J2-C10

MOD2-DATIO01

BUSAP-CH1

MIL-STD-1553, BUS, 24Vp-p (typ)

107

(high speed)

J2-B07

MOD1-DATIO12

EM1-ETH1-TP1-

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

108

TX1-TP2N

J1-D14

TX1-TP2N

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

109

TX1-TP2P

J1-C14

TX1-TP2P

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

110

(high speed)

J2-B09

MOD1-DATIO04

EM1-ETH2-TP1-

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

111

(high speed)

J2-A09

MOD1-DATIO03

EM1-ETH2-TP1+

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

112

(high speed)

J2-C06

MOD1-DATIO15

EM1-ETH1-TP3+

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

113

(high speed)

J2-D06

MOD1-DATIO16

EM1-ETH1-TP3-

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

114

N/C

n/c

115

MOD2-DATIO29

J2-I15

MOD2-DATIO29

AR429-A-CH03

±10V, Bipolar, Return-to-Zero (RZ)

116

MOD2-DATIO30

J2-I13

MOD2-DATIO30

AR429-B-CH03

±10V, Bipolar, Return-to-Zero (RZ)

117

N/C

n/c

118

(high speed)

J2-A05

MOD1-ETH3-TP1P

(n/c)

N/A

119

(high speed)

J2-B05

MOD1-ETH3-TP1N

(n/c)

N/A

120

TX2-TP0N

J1-B15

TX2-TP0N

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

121

TX2-TP0P

J1-A15

TX2-TP0P

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

122

(high speed)

J2-E07

MOD1-DATIO09

EM1-ETH1-TP0+

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

123

(high speed)

J2-F07

MOD1-DATIO10

EM1-ETH1-TP0-

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

124

(high speed)

J2-G08

MOD1-DATIO05

EM1-ETH2-TP2+

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

125

(high speed)

J2-H08

MOD1-DATIO06

EM1-ETH2-TP2-

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

126

MRSTn

J1-I15

MRSTn

(+)3.3/GND signal typ.

127

RTC_STDBY

J1-I03

RTC_STDBY

(+)3.3V typ. (external sourced)

128

N/C

n/c

129

(high speed)

J2-C04

MOD1-ETH3-TP3P

(n/c)

N/A

130

high speed)

J2-D04

MOD1-ETH3-TP3N

(n/c)

N/A

131

TX1-TP0N

J1-D16

TX1-TP0N

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

132

TX1-TP0P

J1-C16

TX1-TP0P

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

133

(high speed)

J2-G06

MOD1-DATIO13

EM1-ETH1-TP2+

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

134

(high speed)

J2-H06

MOD1-DATIO14

EM1-ETH1-TP2-

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

135

MOD2-DATIO07

J2-E11

MOD2-DATIO07

BUSAP-CH2

MIL-STD-1553, BUS, 24Vp-p (typ)

136

GND

GND Reference (signal/system GND)

137

N/C

n/c

138

N/C

n/c

139

TX1-TP1N

J1-H16

TX1-TP1N

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

140

TX1-TP1P

J1-G16

TX1-TP1P

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

141

BP-SATA-RXN

J2-B01

BP-SATA-RXN

LVDS, ~ 250 mV, pk-pk (pending)

142

BP-SATA-RXP

J2-A01

BP-SATA-RXP

LVDS, ~ 250 mV, pk-pk (pending)

143

MOD2-DATIO08

J2-F11

MOD2-DATIO08

BUSAN-CH2

MIL-STD-1553, BUS, 24Vp-p (typ)

144

SER-TXD1

J1-I11

SER-TXD1

RS-232 signal, (+/-12V) typ.

145

SER-RXD1

J1-I09

SER-RXD1

RS-232 signal, (+/-12V) typ.

146

TX2-TP1N

J1-F15

TX2-TP1N

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

147

TX2-TP1P

J1-E15

TX2-TP1P

10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)

148

(high speed)

J2-C02

MOD1-ETH4-TP3P

(n/c)

N/A

149

(high speed)

J2-D02

MOD1-ETH4-TP3N

(n/c)

N/A

150

(high speed)

J2-A03

MOD1-ETH4-TP1P

(n/c)

N/A

151

(high speed)

J2-B03

MOD1-ETH4-TP1N

(n/c)

N/A

Pin-Out / General / I/O Connector (Slot 2-6)

The following pinout is an example of a SIU36 Slot-2 through Slot-6 (SX) populated with a 68G5. Please contact NAI for assistance/consult in generating a configuration specific pinout.

J2-J6 D38999 Connector

68G5 - default

68G5 Pin

Backplane (BP) Pin

BP Signal Name

Signal Description

N/C (ETH2-TXP)

P1-D11

J1-E11

SX-ETH2-TXP

N/C

N/C (ETH2-TXN)

P1-E11

J1-F11

SX-ETH2-TXN

N/C

N/C (ETH1-RXP)

P1-B12

J1-C12

SX-ETH1-RXP

N/C

N/C (ETH1-RXN)

P1-C12

J1-D12

SX-ETH1-RXN

N/C

N/C (ETH2-RXP)

P1-A11

J1-A11

SX-ETH2-RXP

N/C

N/C (ETH2-RXN)

P1-B11

J1-B11

SX-ETH2-RXN

N/C

MOD3-DATIO20

P2-F12

J2-H12

SX-M3-D20

Configuration/Function Specific

MOD3-DATIO07

P2-D15

J2-E15

SX-M3-D07

Configuration/Function Specific

MOD3-DATIO08

P2-E15

J2-F15

SX-M3-D08

Configuration/Function Specific

N/C (ETH1-TXP)

P1-E12

J1-G12

SX-ETH1-TXP

N/C

N/C (ETH1-TXN)

P1-F12

J1-H12

SX-ETH1-TXN

N/C

ETH2-TP1P

P1-D13

J1-E13

SX-ETH2-TP1P

N/C

ETH2-TP1N

P1-E13

J1-F13

SX-ETH2-TP1N

N/C

MOD1-DATIO37

P2-G01

J2-I01

SX-M1-D37

Configuration/Function Specific

MOD1-DATIO38

P2-G03

J2-I03

SX-M1-D38

Configuration/Function Specific

MOD3-DATIO19

P2-E12

J2-G12

SX-M3-D19

Configuration/Function Specific

MOD1-DATIO03

P1-E10

J1-G10

SX-M1-D03

Configuration/Function Specific

GND

GND Reference (signal/system GND)

SER-GND

P1-G13

J1-I13

SX-SER-GND

(N/A, RS232 Debug, if configured)

SER-RXD

P1-G09

J1-I09

SX-SER-RXD

(N/A, RS232 Debug, if configured)

SER-TXD

P1-G11

J1-I11

SX-SER-TXD

(N/A, RS232 Debug, if configured)

ETH2-TP0+

P1-A13

J1-A13

SX-ETH2-TP0P

N/C

ETH2-TP0-

P1-B13

J1-B13

SX-ETH2-TP0N

N/C

MOD3-DATIO27

P2-E10

J2-G10

SX-M3-D27

Configuration/Function Specific

MOD3-DATIO28

P2-F10

J2-H10

SX-M3-D28

Configuration/Function Specific

MOD1-DATIO40

P2-G07

J2-I07

SX-M1-D40

Configuration/Function Specific

MOD2-DATIO19

P2-E04

J2-G04

SX-M2-D19

Configuration/Function Specific

MOD1-DATIO04

P1-F10

J1-H10

SX-M1-D04

Configuration/Function Specific

MOD3-DATIO02

P2-C16

J2-D16

SX-M3-D02

Configuration/Function Specific

MOD3-DATIO01

P2-B16

J2-C16

SX-M3-D01

Configuration/Function Specific

MOD3-DATIO18

P2-C12

J2-D12

SX-M3-D18

Configuration/Function Specific

MOD3-DATIO17

P2-B12

J2-C12

SX-M3-D17

Configuration/Function Specific

ETH2-TP3P

P1-E14

J1-G14

SX-ETH2-TP3P

N/C

ETH2-TP3N

P1-F14

J1-H14

SX-ETH2-TP3N

N/C

MOD3-DATIO15

P2-D13

J2-E13

SX-M3-D15

Configuration/Function Specific

MOD3-DATIO16

P2-E13

J2-F13

SX-M3-D16

Configuration/Function Specific

MOD1-DATIO39

P2-G05

J2-I05

SX-M1-D39

Configuration/Function Specific

MOD2-DATIO20

P2-F04

J2-H04

SX-M2-D20

Configuration/Function Specific

MOD2-DATIO10

P2-C06

J2-D06

SX-M2-D10

Configuration/Function Specific

MOD1-DATIO07

P1-D09

J1-E09

SX-M1-D07

Configuration/Function Specific

MOD3-DATIO22

P2-B11

J2-B11

SX-M3-D22

Configuration/Function Specific

MOD3-DATIO21

P2-A11

J2-A11

SX-M3-D21

Configuration/Function Specific

MOD1-DATIO12

P1-F08

J1-H08

SX-M1-D12

Configuration/Function Specific

MOD1-DATIO11

P1-E08

J1-G08

SX-M1-D11

Configuration/Function Specific

ETH2-TP2P

P1-B14

J1-C14

SX-ETH2-TP2P

N/C

ETH2-TP2N

P1-C14

J1-D14

SX-ETH2-TP2N

N/C

MOD3-DATIO25

P2-B10

J2-C10

SX-M3-D25

Configuration/Function Specific

MOD3-DATIO26

P2-C10

J2-D10

SX-M3-D26

Configuration/Function Specific

GND

GND Reference (signal/system GND)

MOD2-DATIO03

P2-E08

J2-G08

SX-M2-D03

Configuration/Function Specific

MOD2-DATIO09

P2-B06

J2-C06

SX-M2-D09

Configuration/Function Specific

MOD1-DATIO08

P1-E09

J1-F09

SX-M1-D08

Configuration/Function Specific

MOD3-DATIO32

P2-E09

J2-F09

SX-M3-D32

Configuration/Function Specific

MOD3-DATIO31

P2-D09

J2-E09

SX-M3-D31

Configuration/Function Specific

GND

GND Reference (signal/system GND)

MOD1-DATIO24

P1-E05

J1-F05

SX-M1-D24

Configuration/Function Specific

MOD1-DATIO23

P1-D05

J1-E05

SX-M1-D23

Configuration/Function Specific

MOD3-DATIO05

P2-A15

J2-A15

SX-M3-D05

Configuration/Function Specific

MOD3-DATIO06

P2-B15

J2-B15

SX-M3-D06

Configuration/Function Specific

MOD2-DATIO28

P2-F02

J2-H02

SX-M2-D28

Configuration/Function Specific

MOD2-DATIO27

P2-E02

J2-G02

SX-M2-D27

Configuration/Function Specific

MOD2-DATIO04

P2-F08

J2-H08

SX-M2-D04

Configuration/Function Specific

N/C

n/c

N/C

n/c

GND

GND Reference (signal/system GND)

MOD2-DATIO01

P2-B08

J2-C08

SX-M2-D01

Configuration/Function Specific

MOD2-DATIO26

P2-C02

J2-D02

SX-M2-D26

Configuration/Function Specific

MOD1-DATIO06

P1-B09

J1-B09

SX-M1-D06

Configuration/Function Specific

MOD1-DATIO05

P1-A09

J1-A09

SX-M1-D05

Configuration/Function Specific

MOD3-DATIO09

P2-B14

J2-C14

SX-M3-D09

Configuration/Function Specific

MOD3-DATIO10

P2-C14

J2-D14

SX-M3-D10

Configuration/Function Specific

MOD3-DATIO13

P2-A13

J2-A13

SX-M3-D13

Configuration/Function Specific

MOD3-DATIO04

P2-F16

J2-H16

SX-M3-D04

Configuration/Function Specific

MOD3-DATIO03

P2-E16

J2-G16

SX-M3-D03

Configuration/Function Specific

N/C

n/c

N/C

n/c

N/C

n/c

MOD2-DATIO02

P2-C08

J2-D08

SX-M2-D02

Configuration/Function Specific

GND

GND Reference (signal/system GND)

MOD2-DATIO25

P2-B02

J2-C02

SX-M2-D25

Configuration/Function Specific

MOD1-DATIO18

P1-C06

J1-D06

SX-M1-D18

Configuration/Function Specific

MOD1-DATIO17

P1-B06

J1-C06

SX-M1-D17

Configuration/Function Specific

MOD3-DATIO23

P2-D11

J2-E11

SX-M3-D23

Configuration/Function Specific

MOD3-DATIO24

P2-E11

J2-F11

SX-M3-D24

Configuration/Function Specific

MOD3-DATIO14

P2-B13

J2-B13

SX-M3-D14

Configuration/Function Specific

GND

GND Reference (signal/system GND)

N/C

n/c

N/C

n/c

MOD1-DATIO02

P1-C10

J1-D10

SX-M1-D02

Configuration/Function Specific

MOD2-DATIO08

P2-E07

J2-F07

SX-M2-D08

Configuration/Function Specific

MOD2-DATIO07

P2-D07

J2-E07

SX-M2-D07

Configuration/Function Specific

MOD3-DATIO30

P2-B09

J2-B09

SX-M3-D30

Configuration/Function Specific

MOD3-DATIO29

P2-A09

J2-A09

SX-M3-D29

Configuration/Function Specific

MOD2-DATIO05

P2-A07

J2-A07

SX-M2-D05

Configuration/Function Specific

MOD2-DATIO17

P2-B04

J2-C04

SX-M2-D17

Configuration/Function Specific

MOD2-DATIO18

P2-C04

J2-D04

SX-M2-D18

Configuration/Function Specific

MOD1-DATIO31

P1-D03

J1-E03

SX-M1-D31

Configuration/Function Specific

MOD1-DATIO27

P1-E04

J1-G04

SX-M1-D27

Configuration/Function Specific

N/C

n/c

100

N/C

n/c

101

MOD1-DATIO01

P1-B10

J1-C10

SX-M1-D01

Configuration/Function Specific

102

MOD1-DATIO34

P1-C02

J1-D02

SX-M1-D34

Configuration/Function Specific

103

MOD1-DATIO33

P1-B02

J1-C02

SX-M1-D33

Configuration/Function Specific

104

MOD2-DATIO16

P2-E05

J2-F05

SX-M2-D16

Configuration/Function Specific

105

MOD2-DATIO13

P2-A05

J2-A05

SX-M2-D13

Configuration/Function Specific

106

MOD2-DATIO14

P2-B05

J2-B05

SX-M2-D14

Configuration/Function Specific

107

MOD2-DATIO06

P2-B07

J2-B07

SX-M2-D06

Configuration/Function Specific

108

MOD3-DATIO11

P2-E14

J2-G14

SX-M3-D11

Configuration/Function Specific

109

MOD3-DATIO12

P2-F14

J2-H14

SX-M3-D12

Configuration/Function Specific

110

MOD1-DATIO32

P1-E03

J1-F03

SX-M1-D32

Configuration/Function Specific

111

MOD1-DATIO28

P1-F04

J1-H04

SX-M1-D28

Configuration/Function Specific

112

MOD1-DATIO09

P1-B08

J1-C08

SX-M1-D09

Configuration/Function Specific

113

MOD1-DATIO14

P1-A07

J1-A07

SX-M1-D14

Configuration/Function Specific

114

MOD2-DATIO30

P2-B01

J2-B01

SX-M2-D30

Configuration/Function Specific

115

MOD1-DATIO19

P1-E06

J1-G06

SX-M1-D19

Configuration/Function Specific

116

MOD2-DATIO22

P2-B03

J2-B03

SX-M2-D22

Configuration/Function Specific

117

MOD2-DATIO15

P2-D05

J2-E05

SX-M2-D15

Configuration/Function Specific

118

MOD2-DATIO24

P2-E03

J2-F03

SX-M2-D24

Configuration/Function Specific

119

N/C (+5V-USB-)

P2-G13

J2-I13

+5V-USB-SX

(N/A)

120

MOD1-DATIO35

P1-E02

J1-G02

SX-M1-D35

Configuration/Function Specific

121

MOD1-DATIO36

P1-F02

J1-H02

SX-M1-D36

Configuration/Function Specific

122

MOD1-DATIO22

P1-A05

J1-A05

SX-M1-D22

Configuration/Function Specific

123

MOD1-DATIO21

P1-B05

J1-B05

SX-M1-D21

Configuration/Function Specific

124

MOD1-DATIO10

P1-C08

J1-D08

SX-M1-D10

Configuration/Function Specific

125

MOD1-DATIO13

P1-B07

J1-B07

SX-M1-D13

Configuration/Function Specific

126

MOD2-DATIO29

P2-A01

J2-A01

SX-M2-D29

Configuration/Function Specific

127

MOD1-DATIO20

P1-F06

J1-H06

SX-M1-D20

Configuration/Function Specific

128

MOD2-DATIO21

P2-A03

J2-A03

SX-M2-D21

Configuration/Function Specific

129

MOD2-DATIO23

P2-D03

J2-E03

SX-M2-D23

Configuration/Function Specific

130

N/C (USB-GND-)

P2-G15

J2-I15

USB-GND-SX

(N/A)

131

MOD2-DATIO12

P2-F06

J2-H06

SX-M2-D12

Configuration/Function Specific

132

MOD2-DATIO11

P2-E06

J2-G06

SX-M2-D11

Configuration/Function Specific

133

MOD1-DATIO25

P1-B04

J1-C04

SX-M1-D25

Configuration/Function Specific

134

MOD1-DATIO26

P1-C04

J1-D04

SX-M1-D26

Configuration/Function Specific

135

MOD1-DATIO29

P1-B03

J1-B03

SX-M1-D29

Configuration/Function Specific

136

GND

GND Reference (signal/system GND)

137

MOD2-DATIO31

P2-D01

J2-E01

SX-M2-D31

Configuration/Function Specific

138

MOD2-DATIO32

P2-E01

J2-F01

SX-M2-D32

Configuration/Function Specific

139

N/C (-USB-DP)

P2-G09

J2-I09

SX-USB-DP

(N/A)

140

N/C (-USB-DM)

P2-G11

J2-I11

SX-USB-DM

(N/A)

141

ETH1-TP1N

P1-E15

J1-F15

SX-ETH1-TP1N

(N/A)

142

ETH1-TP1P

P1-D15

J1-E15

SX-ETH1-TP1P

(N/A)

143

MOD1-DATIO30

P1-A03

J1-A03

SX-M1-D30

Configuration/Function Specific

144

MOD1-DATIO15

P1-D07

J1-E07

SX-M1-D15

Configuration/Function Specific

145

MOD1-DATIO16

P1-E07

J1-F07

SX-M1-D16

Configuration/Function Specific

146

ETH1-TP2N

P1-C16

J1-D16

SX-ETH1-TP2N

(N/A)

147

ETH1-TP2P

P1-B16

J1-C16

SX-ETH1-TP2P

(N/A)

148

ETH1-TP0-

P1-B15

J1-B15

SX-ETH1-TP0N

(N/A)

149

ETH1-TP0+

P1-A15

J1-A15

SX-ETH1-TP0P

(N/A)

150

ETH1-TP3N

P1-F16

J1-H16

SX-ETH1-TP3N

(N/A)

151

ETH1-TP3P

P1-E16

J1-G16

SX-ETH1-TP3P

(N/A)

General System Functions

PS-ON/OFF#

SIU36 PSU is strapped to be always “ON”. The unit will power-on if external +28V power is applied.

SYSRST#

[GND] or Logic-level “Low” (referenced to internal System GND of the SIU36) initiates/applies an active low assertion to the OpenVPX SYSRST# signal on the cards. Applied and once released, this will effectively introduce a root 'system/card' reset. SYSRST# signal is typically accessed from the SLOT-1 card, J1 MIL-connector.

Note

SYSRST# function is dependent on slot 1 card type/configuration; SYSRST# is typically routed to the “MRSTn” reset input of the SBC (root-complex) /Slot-1 card. If/as applicable, the card issues the RSTn signal on the backplane to all other “end-point” cards within the chassis when SYSRST# is asserted.

PART NUMBER DESIGNATION

Standard Product = SIU36-XXXXX

XXXXX = NAI/Factory assigned unique configuration identifier

Standard Product = SIU36-XXXXX

Chassis Family

SIU36

Chassis Version

XXXXX

- Standard 3U OpenVPX 6-slot card version (plus dedicated PSU slot).

- Pre-Configured Card, Function, Slot Designation and PSU Definitions*.

- Unique product specific configuration code assignment / identifier.

Contact factory for other than standard version**.

Specifications are subject to change without notice.

Notes

*Factory assigned X-digit code will reference the complete SIU configuration information in the NAI Master Code List (MCL) or Part Number Configurator, as assigned and documented at the factory.

SIU mating connector kit part number:

OpenVPX Systems; 4x 151-pin (unique keys) & 1x 13-pin

28 VDC Power: SIU34-CONN-KIT

**If your configuration option is not listed please contact factory at 1-631-567-1100

Revision History

Hardware Manual - SIU36 Revision History

Revision

Revision Date

Description

2022-01-18

ECO C09005, Transition manual to docbuilder format. Pg.5, Revised simplified block diagram (updated profiles for Slots 4 & 6)

2023-04-11

ECO C10276, pg.5, update weight. Pg.5/10, updated CC height from 5.1 to 5.0. Pg.5/10, updated CC/AC depth from 9.0 to 9.5. Pg.10, changed 'length' to 'width'. Pg.10, updated unpopulated weight (incl. PSU); added fully populated weight. Pg.18, added ETC details.

2023-05-25

ECO C10418, pg.5, changed product image to conduction-cooled.

NAI Cares

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We have built a reputation by listening to our customers, understanding their needs, and designing, testing and delivering board and system-level products for their most demanding air, land and sea requirements. If you have any applications or questions regarding the use of our products, please contact us for an expedient solution.

Please visit us at: www.naii.com or select one of the following for immediate assistance:

Documentation

https://www.docs.naii.com

FAQ

http://www.naii.com/faq/

Application Notes

http://www.naii.com/appNotes/

Calibration and Repairs

http://www.naii.com/calibration/

Call Us

(631) 567-1100

Integrator Resources

Compact Rugged Mission Control System

SIU36 DATA SHEET

INTRODUCTION

OBJECTIVES

SCOPE

CONVENTIONS USED IN THIS MANUAL