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3U OpenVPX MFIO Endpoint Board

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Introduction

The 68G6 board is part of NAI’s certifiable product development roadmap and is designed to support DO-178C and DO-254 design assurance guidelines, making it suitable for safety-critical applications. Here are its key features and configurations:

Key Features: Compliance and Profiles:

3U SOSA™-Aligned/VITA 65 OpenVPX Profile Slot Profile: SLT3-PAY-2U2U-14.2.17 Module Profile: MODA3p-16.2.16-1-F2C-(P3U)(2E7) Data and Control Interfaces:

Expansion Plane (P1): 1 x1 PCIe Gen 3 for motherboard/modules (Endpoint default, Root Complex optional) 1 x1 PCIe Gen 3 for module 3 or direct external PCIe interface Control Plane (P1) (TSN Planned): 2x 10GBase-KR Optional IPMC Support:

VITA 46.11 Tier-2 basic compatible. Advanced Security Options:

FIPS 140-3 Layer 3 Hardware Support, Secure Boot. Processing Capability:

Dual or Quad Core ARM -53 Endpoint, up to 1.3 GHz with local processing. 1 GB LPDDR4 and 32 GB SATA Flash. Module Support:

Supports three NAI smart I/O function modules. SerDes interface to function module slots 1, 2, or 3. Independent external 1 x1 PCIe interface to function module slot 3 (variant board). General and Mechanical Information: Connector and Pin-Out Information:

Details on various connectors, including front and rear I/O VPX connectors. Cooling Configurations:

Available in convection-cooled and conduction-cooled configurations. Health Monitoring:

Module BIT Status registers for monitoring the health and status of modules. Part Number Designation:

Standard and variant product designations are provided for ordering based on configuration needs. Applications: The 68G6 is designed for rugged Mil-Aero applications and can be used in a wide range of air, land, and sea applications

Manual

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Click the link below for the full product manual with detailed information.

The manual covers the following topics:

  • Introduction: Overview of the module or board, including its purpose and applications.

  • Features: Key features and functionalities.

  • Specifications: Technical specifications such as dimensions, power requirements, and environmental conditions.

  • Principle of Operation: Detailed explanation of how the module or board operates.

  • Built-In Test (BIT) / Diagnostic Capability: Information on self-test and diagnostic features.

  • Status and Interrupts: Details on status registers and interrupt handling.

  • Pin-Out Details: Specifics on connector pin-outs and wiring.

  • Mounting Requirements: Mechanical mounting information.

  • Qualification: Information on the qualification and compliance standards

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