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3U OpenVPX Dual Ethernet SBC

Introduction

The 68PPC2 is a low-power, high-performance 3U OpenVPX single board computer (SBC) designed for demanding, space-constrained, and resource-limited embedded systems. Key features and capabilities of the 68PPC2 include:

Processor: It is powered by the NXP T2080 Power Architecture processor running at 1.5 GHz. I/O Expansion: Includes two Generation-5 (GEN5) NAI smart I/O function modules for on-board I/O expansion. Connectivity: Features high-density front and rear I/O, with rear I/O connectivity through OpenVPX P0, P1, and P2 rear connectors. These connections include Ethernet, asynchronous serial, I2C, programmable TTL, USB, and access to onboard add-on Module I/O. Memory and Storage: Equipped with 8GB DDR3L SDRAM with ECC, 32GB onboard ROM, 256 MB NOR Flash, and 64 Kb FRAM. Peripheral Interfaces: Four e6500 cores sharing a 2MB L2 cache. Up to two 1 Gbps KX Ethernet MACs. Four PCIe interfaces (1x4 and 4x1 PCIe ports for VPX communication, 1x1 PCIe to Module interface 1, and 1x1 PCIe to the Zynq to R/W to module registers). Two high-speed USB 3.0 ports. Two SATA 2.0 controllers with a SATA switch for external storage or storage through Module Slot-2 (factory configured). RS232 Serial debug port and onboard TTL Digital I/O. It also includes a full complement of software I/O libraries and drivers, making it suitable for integration in commercial and rugged military embedded processing and I/O systems. Additionally, the card supports PCIe bus root-complex and/or Gigabit Ethernet capability and may be used with other high-density multifunction I/O boards to create expandable, low-power, high-performance, and programmable solutions for sensor and communication data acquisition, management, processing, and distribution

Manual

Click the link below for the full product manual with detailed information.

The manual covers the following topics:

  • Introduction: Overview of the module or board, including its purpose and applications.

  • Features: Key features and functionalities.

  • Specifications: Technical specifications such as dimensions, power requirements, and environmental conditions.

  • Principle of Operation: Detailed explanation of how the module or board operates.

  • Built-In Test (BIT) / Diagnostic Capability: Information on self-test and diagnostic features.

  • Status and Interrupts: Details on status registers and interrupt handling.

  • Pin-Out Details: Specifics on connector pin-outs and wiring.

  • Mounting Requirements: Mechanical mounting information.

  • Qualification: Information on the qualification and compliance standards

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