SIU32S Manual

DATA SHEET

Click here for the SIU32S data sheet

INTRODUCTION

North Atlantic Industries’ (NAI) Sensor Interface Unit (SIU32S) is a rugged base-plate conduction-cooled chassis that leverages and integrates NAI’s Configurable Open Systems Architecture™ (COSA ®) rugged conduction-cooled 3U OpenVPX SBC, multi-function I/O boards and power supply products. The SIU32S provides a compact, high density, processing & graphics capable data distribution system solution for I/O intensive, mission or control systems applications. The SIU32S supports board-level processing and full I/O control and communication over Ethernet. With local processing, MIL-STD-1553, ARINC 429/575, Serial or ARINC 825 CAN bus are also available as primary communications interfaces when the boards are configured as such. PowerPC, Intel® or ARM Single Board Computer (SBC) processors can be added for a complete processing and I/O solution. The SIU32S is designed to support up to two NAI multi-function pre-configurable SBC/multifunction I/O boards, with or without processing, that support a wide variety of interface and communications smart function modules, all fitted/housed in a single rugged multi-board slot SIU system chassis, which is “delivered” pre-integrated and fully tested as a system.

OBJECTIVES

This manual provides the user with basic hardware implementation and information regarding the operation and interface of the SIU32S. Each SIU32S is fitted with either one to two 3U OpenVPX boards and a single mil-standard power supply unit. Additional PSU option for “hold-up” power/time is available.

SCOPE

This manual only covers the operation of the SIU32S as a stand-alone I/O subsystem. This manual does not cover specific details relating to the operation of the specific I/O boards and function module fitted within the SIU32S. Please reference the board specific documentation for details regarding the board level configuration(s).

CONVENTIONS USED IN THIS MANUAL

WARNINGS, CAUTIONS, and NOTES

Note

An operating procedure, practice, or condition, etc., that is essential to emphasize. All numbers are expressed in decimal format unless otherwise noted.

GENERAL SAFETY NOTICES

The following general safety notices supplement the specific warnings and cautions appearing elsewhere in the manual. They are recommended precautions that must be understood and applied during operation and maintenance of the instrument covered herein.

Serious injury may result if personnel fail to observe safety precautions. Dependent on configuration, some modules (e.g. Synchro / Resolver or AC signal sources) can generate output signals with high voltages. Be careful not to contact high-voltage connections when installing, operating or maintaining this instrument.

The SIU32S is delivered as a standalone system with no accessible or serviceable parts.

REPAIR

DO NOT ATTEMPT REPAIR. Under no circumstances should repair of this instrument be attempted. All repairs to this chassis must be accomplished at the factory.

HIGH VOLTAGE

HIGH VOLTAGE may be used in the operation of this equipment.

INPUT POWER ALWAYS ON

Note

The design of the model SIU32S is such that input power is continuously supplied to internal circuits when connected to a main power source. To disconnect the SIU32S from external power, the external power source should first be de-energized. The power input cable can then be disconnected.

Website https://www.naii.com/

SYSTEM SPECIFICATIONS AND DETAILS

Introduction

The model SIU32S is a next generation rugged systems chassis joining the NAI Sensor Interface Unit (SIU) system chassis family pedigree. The SIU32S is configured to support a wide variety of SBC and multifunction I/O boards that can be configured to support a variety of processing, communications and I/O functions that are supported under the NAI Configurable Open Systems Architecture™ (COSA®) product families.

The SIU32S can function either as a centralized or distributed system. It can also be used to supplement existing legacy systems by easily adding sensor data acquisition as well as general I/O and communication interfaces without expensive legacy chassis and backplane redesign. It has been designed with rugged embedded industrial, military and aerospace applications in mind.

Leveraging NAI’s field-proven, unique modular architecture, the SIU32S supports standard 3U OpenVPX board-level compatible boards that can be fitted with a wide selection of different Intelligent I/O, motion simulation/measurement and communications functions such as:

A/D Converter	D/A Converter	I/O TTL/CMOS	RTD	I/O Discrete
I/O Differential Transceiver	Synchro/Resolver LVDT/RVDT Measurement	Synchro/Resolver LVDT/RVDT Simulation	Strain Gauge	Encoder
Dual-Channel Dual Redundant BC/RT/MT MIL-STD-1553	High-Speed Sync/Async RS232/422/423/485	ARINC 429/575	CAN Bus	I/O Relay
AC Reference	Ethernet Switch	SSD/Flash	Check w/ NAI's factory or website for latest selection of available functions

This approach provides unprecedented flexibility for supporting existing or new applications where there are specific interfacing requirements.

Significant application benefits include:

• Independent (pre-processed) I/O functionality targeted to specific data acquisition/control areas
• Additional capabilities, technology insertion and sensor interfacing to existing fielded applications
• Minimal integration risk based on current field-proven, deployed technologies

Specifications

The SIU32S is designed to meet the following general product specifications and is provided as a reference. Actual configuration and usage may affect size, weight, and power (SWaP) specifications. Please contact NAI for discerning/defining SWaP considerations regarding specific program configurations. See additional details herein.

General

SIU32S General SWaP Specifications

Input Voltage	Standard/Default: DC: 18 to 36 VDC (28 VDC nominal)
Power (Base unit):	~10 W (PSU efficiency, at 100W load) @ 28 VDC nominal Then, add the power calculated for the configuration-specific board’s module(s) power (see separate specific boards and module(s) specifications). I/O Signal GND reference is isolated from main power source return and chassis.
Power/Heat Dissipation:	Conduction Cooled (CC): ~90 watts (maximum) when properly mounted to a cold plate, which must be maintained at a temperature not to exceed 71°C. Air/Convection Cooled (AC) Contact/consult with NAI for configuration and power dissipation. SIU Air/Convection version maximum power dissipation is dependent, but not limited to, configuration, power dissipation, air flow, program and other environmental considerations. NOTE: The total SIU32S power dissipation is dependent on the configuration of the boards and function module types fitted in the SIU32S. Environmental and other operating characteristic variable considerations should be considered.
Temperature, Operating:	-40°C to 71°C Conduction cooled: As measured at primary thermal transfer interface.
Temperature, Storage:	-55°C to 105°C
Size:	Height: ~4.6” (117 mm) CC / ~4.8” (122 mm) AC (w/additional heat dissipator fin height) Depth: ~9.5” (241 mm) Width: ~6.0” (152 mm) CC or ~6.2” (157 mm) AC
Weight:	The weight of an SIU32S system is dependent on the configuration. The approximate weight of the SIU32S is based on the selection of the PSU, boards and functional module(s). The approximate weight of a configured SIU32S is: ~8.8 lbs. unpopulated - Chassis/backplane/rigid flex & connector boards/PSU (conduction cooled) (includes ~2.2 lbs. for PSU) ~9.1 lbs. unpopulated - Chassis/backplane/rigid flex & connector boards/PSU (air/convection cooled) (includes ~2.2 lbs. for PSU) ~11.5 lbs. fully populated (conduction cooled) (includes ~1.35 lbs. for each additional fully function module populated board) ~11.8 lbs. fully populated (air/convection cooled) (includes ~1.35 lbs. for each additional fully function module populated board)

UNPACKING AND INSPECTION

Unpacking

The SIU32S packing materials were designed specifically for transport protection of the SIU32S. When receiving the shipment container, inspect packaging for any evidence of physical damage. If damage is evident, it is recommended that the carrier agent is present when opening the shipping container. It is further recommended that all packing material is retained in the event the SIU32S needs to be shipped elsewhere.

System/Chassis Identification

An identification label, indicating part number, unique serial number and Ethernet PHY MACs / default IP address(es) is affixed to the system chassis.

Figure 1. SIU32S Unit Identification Label Location

Label information provided

• Unit Level Part Number Unit
• Level Serial Number Unit
• Level Date Code

Also, typically provided with:

• Slot/Board configuration(s) as applicable
• Slot/Board serial numbers and D/C
• Slot/Board IP address / MAC address (if applicable)

Special labeling requirements are also considered (i.e. UID matrix, customer part number, etc.). Contact factory for special labeling requirements.

Inspection

Inspect the chassis and connectors to ensure that they were not damaged during transit.

MECHANICAL INTERFACE

Mechanical Description

The standard SIU32S is a rugged milled 6061 aerospace grade aluminum alloy stock. Conduction cooled version is expected to be mounted to a thermally conductive surface to maintain the specified temperature. The system thermal management design considerations should ensure that the chassis thermal interface (SIU32S bottom surface) does not exceed 71°C. Mounting holes are provided on the chassis bottom housing flanges (as depicted).

Maximum power and heat dissipation are dependent on the board and function complement chosen. Contact NAI for application guidance. See the reference outline drawing(s) below.

Mounting Requirements

The SIU32S is conduction cooled and must be mounted in accordance with the drawing. The Outline and Installation Drawing (OID) provides recommended hardware, torque, cold-plate flatness and surface finish specifications, and thermal conductivity requirements.

Figure 2. SIU32S Conduction Cooled Outline Dimensions & Mounting Pattern (Reference Only)

Notes:

1. For reference only.
2. Unless otherwise specified, dimensions are in inches (mm); tolerances are:

• 2 PL DEC ±0.01; 3 PL DEC ±0.005
• FRACT ±1/64 (0.4); ANGLES ±1/2 (12.7)

Figure 3. SIU32S Conduction Cooled w/Fiber Optic Option Outline Dimensions & Mounting Pattern (Reference Only)

Notes:

1. For reference only.
2. Unless otherwise specified, dimensions are in inches (mm); tolerances are:

• 2 PL DEC ±0.01; 3 PL DEC ±0.005
• FRACT ±1/64 (0.4); ANGLES ±1/2 (12.7)

Chassis (Earth) GND

Chassis ground point threaded insert location is on the connector face (front) of the SIU32S as shown.

Figure 4. SIU32S Outline Dimensions/Chassis GND location

Note:

A Chassis GND braid or equivalent is expected to be secured by the following hardware or equivalent (delivered/installed with the SIU32S assembly):

• SCREW, SOCKET HEAD CAP, 8-32, ½” LONG, 18-8 SS
• Lock Washer, #8, 0.174” ID, 0.293” OD, 18-8 SS
• Flat Washer, #8, 0.172” ID, 0.375” OD, 18-8 SS

Securing information:

• The chassis is designed/built with a helical insert: NAS1130-08-15 or equivalent (8-32 Helical Insert, 0.246” Length, 18-8 Stainless Steel)
• Maximum screw/insert hole depth is 0.4”
• Recommended torque for the SIU32S Chassis GND screw: 15 in-lbs. (170 N-cm)

Finish

Unless otherwise specified, the following standard finish, or equivalent per NAI process requirements applies:

1. PRE-TREATMENT: CHEMICAL FILM COATING IAW MIL-DTL-5541, TYPE II, CLASS 3, ALL OVER.
2. PAINT PRIMER COAT: IAW-MIL-PRF-23377, TYPE II, CLASS 2, WITH A 0.9MIL MINIMUM DRY FILM THICKNESS TO EXTERIOR SURFACES SHOWN IN PAINT MASKING FIGURES.
3. PAINT FINISH COAT: APPLY MEDIUM TEXTURE USING PER MIL-PRF-85285, TYPE I, CLASS 2, SEMI-GLOSS BLACK WITH A DRY FILM THICKNESS OF 0.0008 TO 0.0012 TO EXTERIOR SURFACES.
4. FINISH NOTES 2 AND 3 OMITTED FROM THERMAL INTERFACE SURFACE INDICATED & FROM ALL HARDWARE.

CONNECTOR DESIGNATIONS, LOCATIONS & DESCRIPTIONS

The Power, I/O Interface and Ethernet connectors are located on the SIU32S front panel housing.

Figure 5. SIU32S (Front Panel Connector Placement)

SIU32S Connector Designation and Description

REF. DES.
KEY
MANUFACTURER / MIL-DTL SPEC. (or Equiv.)
P/N
MATE P/N
J1
N
AMPHENOL
TVP02RF-23-151S(S2AD)
TV06RF-23-151P
J2
A
AMPHENOL
TVP02RF-23-151SA(S2AD)
TV06RF-23-151PA
J3
A
MIL-DTL-D38999 Type
D38999/20FB35PA
D38999/26FB35SA
J4 (Option)
N
AMPHENOL
CF-594011-01S w/MALE MT 12 FIBER FERRULE
CF-594611-01P w/FEMALE MT 12 FIBER FIRRULE
J5 (Option)
AMPHENOL
HD-BNC JACK (75 OHM)
HD-BNC JACK (75 OHM)
J6 (Option)
AMPHENOL
HD-BNC JACK (75 OHM)
HD-BNC JACK (75 OHM)
J7 (Option)
AMPHENOL
HD-BNC JACK (75 OHM)
HD-BNC JACK (75 OHM)
J8 (Option)
AMPHENOL
HD-BNC JACK (75 OHM)
HD-BNC JACK (75 OHM)

CONNECTOR DETAILS AND PINOUTS

Generic pinout. See module I/O section or contact factory regarding any special module I/O configuration.

J3, Primary Power Connector

Primary input power is supported on the SIU32S via the J3 connector. Power input for the SIU32S: 28 VDC (standard, default).

28 VDC Input Connector

Part Number: TVP02RW-11-35PN, (w/ 10,000 pf conn filtering)

Equivalent to MIL-DTL-D38999 Series III and insert arrangement IAW MIL-STD-1560: Shell size 11-35 (Insert 35), “A” key, 13 pins.

Input Mating Connector: D38999/26WB35SA or equivalent

Figure 6. 28 VDC Pin Insert Arrangement, Front View

.28 VDC Pin-out

J3 Pin	SIU32S Power Input
1, 2, 10, 11	28V-PRI
6, 7, 8, 13	28V-SEC
3, 4, 5, 12	28V-RTN
9	Chassis GND
Each pin is rated at 3 A (max.).

I/O Connectors (J1 to J2) and SLOT Designations

Connectors J1 and J2 route all the I/O from the two OpenVPX boards within the SIU32S. The I/O pins from the boards (user defined, and factory configured) are designated from the 3U board slot locations. The Slot-X P1 and P2 connectors of the OpenVPX cards are routed through the backplane to the SIU32S front panel connector rigid-flex assemblies. The specific I/O pin-out information for the J1 and J2 is defined by the configuration of the OpenVPX boards and function modules fitted to the OpenVPX boards.

Unless otherwise specified: MIL-DTL-38999 HD Type III or Equiv. / Electroless Nickel

Jx Designation	SIU32S Connector MFG. P/N (or equivalent)	Board #	NAI Conn P/N
J1	TVP02RF-23-151S(S2AD)	Slot-1	05-0473-COM
J2	TVP02RF-23-151SA(S2AD)	Slot-2	05-0468-COM
(J3)	(D38999/20FB35PA)	[ PSU (Slot-3) ]	(05-0662-COM)

Figure 7. SIU32S Slot and Connector Association Details

Mating Connector Information

Mating Connector Kit; NAI P/N: SIU32S-CONN-KIT

Available as an optional separate line item. The mating connector kit includes 1 each (or equivalent): MIL-DTL-38999 HD Type III or Equiv.

J1 Mate	NAI P/N: 05-0480-COM HD38999 Type III / TV06RF23-151PN / EN, 151-pin, N-Key
J2 Mate	NAI P/N : 05-0475-COM HD38999 Type III / TV06RF23-151PA / EN, 151-pin, A-Key
J3 Mate	NAI P/N : 05-0671-COM D38999/26FB35SA / OD, 13-pin, A-Key
J4 Mate (Option)	NAI P/N : 05-0529-COM CONN, MT38999, CIRCULAR, FIBER OPTIC, 11-01, N-Key
J5 - J8 Mate (Option)	NAI P/N : 07-0148 Cable Assembly, BNC Plug to HD-BNC Plug, 75 OHM, Belden 4855R, 78.7”
EN: Electroless Nickel; OD: Olive drab, Cadmium plated

POWER-UP AND BASIC OPERATIONS

Panel LEDs & Functions

Front Panel Power & Status LED Indicators

Figure 8. SIU32S Status LEDs Location

SIU32S Status LEDs Function

LED	STATUS / FUNCTION
	ILLUMINATED	EXTINGUISHED
POWER GRN:	Blinking: Initializing Steady On: Power-On/Ready	Power-off
*STATUS RED:	Module BIT (Attention required)	No Module BIT Attention Required

*Status LED operations: Unless otherwise specified, default Status LED operations is controlled by the Slot-1 SBC/Root Complex card over the internal I2C communications link and functionally defined by the customer applied software application (the register is 0x38).

Elapsed Time Counter (ETC)

Integrated within the SIU32S backplane is an Elapsed Time Counter (ETC) IC, which records the accumulated time that the elapsed time recorder’s Event pin has been held high (in 250 ms increments). The ETC is stored on the chip from registers 0x0A-0x0D and read by the Slot-1 SBC/Root Complex card over the internal I2C communications link (the register is 0x6B).

Basic Operations

The SIU32S is delivered as a tested unit. All pins and operation have been verified. It is recommended that Power and Ethernet connections be made to verify operation of the boards fitted within the SIU32S by making use of NAI’s Embedded Soft Panel based GUI sample application that can be utilized as a board level “exercising” tool (if the SIU32S card configuration supports). The example process below describes the use of NAI’s Ethernet communications software tool.

After applying appropriate power to the SIU32S, connect a host computer (laptop or similar running Windows or Linux), to the appropriate Ethernet enabled/configured board (configured/populated in slot 1) Port A or Port B. The selection of Ethernet Port A or B is dependent on Slot-1 OpenVPX board configuration.

Note

Ethernet port assignments, MAC address, and factory default IP address are indicated on the chassis label.

QUALIFICATION

The SIU32S has been designed to meet the following general specifications. Cooling type, size, weight, power and environmental characteristics may affect the program requirements and the specifications as applied. Contact factory for the SIU32S Qualification Test status.

Environmental

Environmental Qualification Testing Specifications

*Environmental MIL-STD-810 (1) (unless otherwise specified)
No.	Description	Procedure	Cycles	Table	Figure	Comments
514	Random Vibe					Method 514.6, 0.1g2/Hz from 100 to 1K Hz., -3dB octave 5-100 Hz and -6dB 1K-2K Hz,(operational)
514	Sinusoidal Vibe					TBD
501	Temp (High)		3			3 periods (@ 4 hrs. ea.) within 24 hrs. cycle at 71 ºC baseplate
502	Temp (Low)		1			3 periods (@ 4 hrs. ea.) within 24 hrs. cycle at -40 ºC baseplate
503	Temp (Shock)		3			3 x 1 hr. each hot & cold cycle
507	Humidity	II	10	507.5-7	507.5-IX	Cyclic high humidity (Cycle B2)
500	Altitude (50K)	II	1	n/a	n/a	10m/s to 50,000ft for 1 hr.
513	Acceleration	II	1	513.6-II	n/a	Carrier-based Aircraft (18g's max)
516	Shock - Operating	I	3	516.6-I	n/a	40g's, 1 min each x 6 axis
516	Shock - Crash	V	3	516.6-I	n/a	75g's, 1 min each x 6 axis
*Ingress Protection IEC 60529 (*1, 2)
No.	Description	Procedure	Cycles	Table	Figure	Comments
IP54	Dust Protection					(other - pending characterization /contact factory)
IP54	Water Splashing					(other - pending characterization /contact factory)
IP65	Dust Tight					(other - pending characterization /contact factory)
IP65	Water Jets					(other - pending characterization /contact factory)

EMI/EMC Specifications

EMI/EMC Qualification Testing Specifications

*EMC / MIL-STD-461 (*1, 2) (unless otherwise specified)
MIL-STD-461F	Method/Curve/Procedure	Comments
CE102	Conducted, Emissions, Power Leads, 10K - 10M Hz
CS101	Conducted, Susceptibility, Power Leads, 30 - 150K Hz
CS106	Conducted, Susceptibility, Power Leads
CS114	Conducted, Susceptibility, Power Leads, 10K - 10M Hz
CS115	Conducted, Susceptibility, Bulk Injection
CS116	Conducted, Susceptibility, SIN Transient 10K - 100M Hz
RE101	Radiated, Emissions, Magnetic Field, 30 - 100K Hz
RE102	Radiated, Emissions, Electric Field, 10K - 1.25G Hz
RS101	Radiated, Susceptibility, Magnetic Field, 30 - 100K Hz
RS103	Radiated, Susceptibility, Electric Field, 2M - 18G Hz

Notes:

*1 - Designed to meet / Generic Test Reports Available

*2 - Utilizing proper shielded cables and system grounding practices

HEAT DISSIPATION

The SIU32S is capable of dissipating up to a total of 90 Watts when properly mounted. Generally, the conduction cooled version thermal interface must be maintained at a temperature not to exceed 71°C. Other operating and environmental factors and variable must be considered when specifying for a higher-level system platform integration. The total SIU32S power dissipation is dependent on the configuration of the OpenVPX boards and power supply fitted in the SIU32S.

RELIABILITY

The reliability of the SIU32S is dependent on the configuration of the OpenVPX boards and power supply fitted within it. The Mean Time between Failures is for the SIU32S configured with chassis, backplane, EMI Filter and connectors.

MTBF

The Mean Time between Failures is configuration, environment, and temperature dependent. Please contact factory regarding calculations based on the specific configuration and program requirements.

SIGNAL PIN-OUTS

The following pinout tables provide a general use guideline AS AN EXAMPLE, ONLY. Pinout routing will be dependent on card type/configuration for optimal I/O usage. Consult NAI factory for assistance in determining specific configuration signal definitions as applicable.

Pin-Out / General / I/O Connector (Slot 1)

The following pinout is an example of a SIU32S Slot-1 populated with a 68INT6-N SBC fitted with two CM5, 2-Channel Dual-Redundant MIL-STD- 1553 & 8-Channel ARINC 429/575 function module and a DT1, 24-Channel discrete input/output function module.

J1 MIL Connector	68INT6-N (as Configured)	MOD-1 / CM5	MOD-2 / DT1	Signal Description
1	ETH2-TP2P			10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)
2	ETH2-TP2N			10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)
3	ETH2-TP3P			10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)
4	ETH2-TP3N			10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)
7	MOD2_DATIO06		DT-IO-GND	Discrete I/O, 0-60Vdc, programmable Input/Output
8	MOD2_DATIO11		VCC2 (7-12)	Discrete I/O, 0-60Vdc, programmable Input/Output
9	MOD2_DATIO 12		DT-IO-GND	Discrete I/O, 0-60Vdc, programmable Input/Output
10	USB1-SSRXP			USB1
11	USB1-SSRXN			USB1
12	MOD2_DATIO 04		IO-CH04	Discrete I/O, 0-60Vdc, programmable Input/Output
13	MOD2_DATIO03		IO-CH03	Discrete I/O, 0-60Vdc, programmable Input/Output
14	TTL_CH1			TTL
15	TTL_CH2			TTL
16	MOD2_DATIO 05		VCC1 (1-6)	Discrete I/O, 0-60Vdc, programmable Input/Output
17	+5V-USB2			+5v for USB2
18	GDISCRETE1			GDiscrete1
19				GND
22	TTL_CH4			USB1
23	TTL_CH3			TTL
24	MOD2_DATIO 16		IO-CH16	Discrete I/O, 0-60Vdc, programmable Input/Output
25	MOD2_DATIO15		IO-CH15	Discrete I/O, 0-60Vdc, programmable Input/Output
28				GND
31	MOD1_DATIO 17	AR429-A-CH04		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
32	MOD1_DATIO 18	AR429-B-CH04		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
33	+5V-USB1			+5v for USB1
34				GND
35	MOD2_DATIO28		IO-CH12	Discrete I/O, 0-60Vdc, programmable Input/Output
36	MOD2_DATIO 27		IO-CH11	Discrete I/O, 0-60Vdc, programmable Input/Output
40	MOD2_DATIO 31		IO-CH23	Discrete I/O, 0-60Vdc, programmable Input/Output
41	MOD2_DATIO23		VCC4 (19-24)	Discrete I/O, 0-60Vdc, programmable Input/Output
42	MOD2_DATIO 24		DT-IO-GND	Discrete I/O, 0-60Vdc, programmable Input/Output
43	MOD1_DATIO 21	AR429-A-CH06		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
44	MOD1_DATIO 22	AR429-B-CH06		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
45	MOD2_DATIO 18		DT-IO-GND	Discrete I/O, 0-60Vdc, programmable Input/Output
46	MOD2_DATIO 17		VCC3 (13-18)	Discrete I/O, 0-60Vdc, programmable Input/Output
47	MOD2_DATIO 19		IO-CH19	Discrete I/O, 0-60Vdc, programmable Input/Output
48	MOD2_DATIO20		IO-CH20	Discrete I/O, 0-60Vdc, programmable Input/Output
52	MOD2_DATIO32		IO-CH24	Discrete I/O, 0-60Vdc, programmable Input/Output
53	MOD1_DATIO 02	BUSAN-CH1		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
54	MOD1_DATIO 01	BUSAP-CH1		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
55				GND
56	DDP-B1-DN			Video DisplayPort (DDI) + HDMI
57	DDP-B1-DP			Video DisplayPort (DDI) + HDMI
58	USB2N			USB2
59	USB2P			USB2
60	MOD2_DATIO26		IO-CH06	Discrete I/O, 0-60Vdc, programmable Input/Output
61	MOD2_DATIO 25		IO-CH05	Discrete I/O, 0-60Vdc, programmable Input/Output
63				GND
64	VID-PWR			Video DisplayPort (DDI) + HDMI
65	HDMI-HPD			Video DisplayPort (DDI) + HDMI
67				GND
68	DDP-B3-DN			Video DisplayPort (DDI) + HDMI
69	DDP-B3-DP			Video DisplayPort (DDI) + HDMI
70	USB1-SSTXN			USB1
71	USB1-SSTXP			USB1
72	MOD2_DATIO13		IO-CH13	Discrete I/O, 0-60Vdc, programmable Input/Output
73	MOD2_DATIO09		IO-CH09	Discrete I/O, 0-60Vdc, programmable Input/Output
74	MOD2_DATIO 10		IO-CH10	Discrete I/O, 0-60Vdc, programmable Input/Output
81	VPX-SATA1-TXP			SATA
82	VPX-SATA1-TXN			SATA
85	MOD2_DATIO 14		IO-CH14	Discrete I/O, 0-60Vdc, programmable Input/Output
88	SER-TXD0			Transmit for Serial Channel 0
89	SER-RXD0			Receive for Serial Channel 0
90	SER-TXD1			Transmit for Serial Channel 1
91	SER-RXD1			Receive for Serial Channel 1
92				GND
94	MOD1_DATIO 11	CH1-STANDARD/BNP1		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
95	USB1N			USB1
96	USB1P			USB1
97	MOD2_DATIO21		IO-CH21	Discrete I/O, 0-60Vdc, programmable Input/Output
98	MOD2_DATIO 22		IO-CH22	Discrete I/O, 0-60Vdc, programmable Input/Output
100				GND
103	MOD1_DATIO 08	BUSAN-CH2		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
104	MOD1_DATIO 07	BUSAP-CH2		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
105	MOD2_DATIO02		IO-CH02	Discrete I/O, 0-60Vdc, programmable Input/Output
106	MOD2_DATIO 01		IO-CH01	Discrete I/O, 0-60Vdc, programmable Input/Output
107	MOD1_DATIO 12	CH1-MODE0/BNN1		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
110	MOD1_DATIO 04	BUSBN-CH1		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
111	MOD1_DATIO 03	BUSBP-CH1		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
112	MOD1_DATIO 15	AR429-A-CH02		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
113	MOD1_DATIO 16	AR429-B-CH02		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
115	MOD2_DATIO 29		IO-CH17	Discrete I/O, 0-60Vdc, programmable Input/Output
116	MOD2_DATIO30		IO-CH18	Discrete I/O, 0-60Vdc, programmable Input/Output
118	MOD1_DATIO 20	AR429-B-CH05		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
119	MOD1_DATIO 19	AR429-A-CH05		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
120	ETH2-TP0N			10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)
121	ETH2-TP0P			10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)
122	MOD1_DATIO 09	BUSBP-CH2		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
123	MOD1_DATIO 10	BUSBN-CH2		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
124	MOD1_DATIO 05	CH1-RT-ADDR2/ANP1		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
125	MOD1_DATIO 06	CH1-RT-ADDR3/ANN1		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
126	MRSTn			MRST
127	RTC-STDBY			RTC Standby
129	MOD1_DATIO 24	AR429-B-CH08		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
130	MOD1_DATIO 23	AR429-A-CH08		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
133	MOD1_DATIO 13	AR429-A-CH01		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
134	MOD1_DATIO 14	AR429-B-CH01		2 CH. Dual-redundant MIL-STD-1553 & 8 Channel ARINC429/575
135	MOD2_DATIO 07		IO-CH07	Discrete I/O, 0-60Vdc, programmable Input/Output
136				GND
137				GND
138	HDMI-SCL-AUXP			Video DisplayPort (DDI) + HDMI
139	HDMI-SDA-AUXN			Video DisplayPort (DDI) + HDMI
140				GND
141	VPX-SATA1-RXN			SATA
142	VPX-SATA1-RXP			SATA
143	MOD2_DATIO08		IO-CH08	Discrete I/O, 0-60Vdc, programmable Input/Output
144	SER-TXD2			SER-TXD Serial Channel 2 RS-232 signal, (+/-12V) typ.
145	SER-RXD2			SER-RXD Serial Channel 2 RS-232 signal, (+/-12V) typ.
146	ETH2-TP1N			10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)
147	ETH2-TP1P			10/100/1000BASE-T, ± 2.5V typ. (over twisted pair)
148	DDP-B2-DP			Video DisplayPort (DDI) + HDMI
149	DDP-B2-DN			Video DisplayPort (DDI) + HDMI
150	DDP-B0-DP			Video DisplayPort (DDI) + HDMI
151	DDP-B0-DN			Video DisplayPort (DDI) + HDMI
	KX-S1-INN			10GBase-KR
	KX-S1-INP			10GBase-KR
	KX-S1-OUTN			10GBase-KR
	KX-S1-OUTP			10GBase-KR
	KX-S3-INN			10GBase-KR
	KX-S3-INP			10GBase-KR
	KX-S3-OUTN			10GBase-KR
	KX-S3-OUTP			10GBase-KR
	P1-SYSCONn			SYSCON
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c
				n/c

Pin-Out / General / I/O Connector (Slot 2)

The following pinout is an example of a SIU32S Slot-2 populated with a 68G5P. Please contact NAI for assistance/consult in generating a configuration specific pinout.

J2 MIL Connector	68G5P (as Configured)	MOD-1 / DA1	MOD-2 / FM9	MOD-3 / TN1	Signal Description
7					GND Reference (signal/system GND)
16	MOD1-DATIO09	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	17	MOD1-DATIO10	OUT_CH05-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	19
	GND Reference (signal/system GND)	24	MOD1-DATIO13	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	25	MOD1-DATIO14	OUT_CH07-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	26
	GND Reference (signal/system GND)	27	MOD1-DATIO27	EXT-REF+
	12 Ch. ±10 VDC or ± 25 mA / Ch.	28	MOD1-DATIO28	EXT-REF-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	29	MOD1-DATIO23	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	30	MOD1-DATIO24	OUT_CH12-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	35	MOD1-DATIO21	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	36	MOD1-DATIO22	OUT_CH11-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	38	MOD1-DATIO19	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	39	MOD1-DATIO20	OUT_CH10-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	42	(N/A, SER-GND)
	N/A (RS232 Debug, if configured)	43	MOD1-DATIO11	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	44	MOD1-DATIO12	OUT_CH06-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	45	MOD3-DATIO28
TSN-ETH4-TP1-	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	46	MOD3-DATIO27
TSN-ETH4-TP1+	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	47
	GND Reference (signal/system GND)	48	MOD1-DATIO29	EXT-SYNC+
	12 Ch. ±10 VDC or ± 25 mA / Ch.	49	MOD1-DATIO30	EXT-SYNC-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	51	MOD1-DATIO15	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	52	MOD1-DATIO16	OUT_CH08-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	54	(N/A, SER-TXD)
	N/A (RS232 Debug, if configured)	55	(N/A, SER-RXD)
	N/A (RS232 Debug, if configured)	56	MOD1-DATIO03	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	57	MOD1-DATIO04	OUT_CH02-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	58	MOD3-DATIO32
TSN-ETH4-TP3-	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	59	MOD3-DATIO31
TSN-ETH4-TP3+	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	60	MOD1-DATIO25
	12 Ch. ±10 VDC or ± 25 mA / Ch.	61	MOD1-DATIO26
	12 Ch. ±10 VDC or ± 25 mA / Ch.	63	MOD1-DATIO07	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	63
	N/C	64	MOD1-DATIO08	OUT_CH04-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	67
	GND Reference (signal/system GND)	70	MOD3-DATIO26
TSN-ETH4-TP0-	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	71	MOD3-DATIO25
TSN-ETH4-TP0+	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	74
	GND Reference (signal/system GND)	75	MOD2-DATIO31		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	76	MOD2-DATIO32		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	77
	N/C	78	MOD2-DATIO09		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	79	MOD2-DATIO10		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	83	MOD3-DATIO29
TSN-ETH4-TP2+	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	84	MOD3-DATIO30
TSN-ETH4-TP2-	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	85	MOD1-DATIO17	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	86	MOD1-DATIO18	OUT_CH09-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	87	MOD2-DATIO27		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	88	MOD2-DATIO28		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	90	MOD2-DATIO03		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	91	MOD2-DATIO04		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	92	MOD2-DATIO01		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	93	MOD2-DATIO02		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	95	MOD3-DATIO20
TSN-ETH3-TP1-	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	96	MOD3-DATIO19
TSN-ETH3-TP1+	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	98	MOD2-DATIO23		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	99	MOD2-DATIO24		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	100	MOD2-DATIO15		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	101	MOD2-DATIO16		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	102	MOD2-DATIO07		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	103	MOD2-DATIO08		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	104	MOD2-DATIO05		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	105	MOD2-DATIO06		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	106	MOD3-DATIO14
TSN-ETH2-TP2-	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	107	MOD3-DATIO13
TSN-ETH2-TP2+	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	108	MOD3-DATIO24
TSN-ETH3-TP3-	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	109	MOD3-DATIO23
TSN-ETH3-TP3+	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	110	MOD1-DATIO05	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	111	MOD1-DATIO06	OUT_CH03-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	112	MOD2-DATIO19		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	113	MOD2-DATIO20		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	114	MOD2-DATIO11		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	115	MOD2-DATIO12		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	118	MOD3-DATIO09
TSN-ETH2-TP0+	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	119	MOD3-DATIO10
TSN-ETH2-TP0-	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	120	MOD3-DATIO18
TSN-ETH3-TP0-	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	121	MOD3-DATIO17
TSN-ETH3-TP0+	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	123	MOD1-DATIO01	OUT_CH
	12 Ch. ±10 VDC or ± 25 mA / Ch.	124	MOD1-DATIO02	OUT_CH01-
	12 Ch. ±10 VDC or ± 25 mA / Ch.	125	MOD2-DATIO21		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	126	MOD2-DATIO22		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	127	MOD2-DATIO13		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	128	MOD2-DATIO14		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	129	MOD3-DATIO15
TSN-ETH2-TP3+	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	130	MOD3-DATIO16
TSN-ETH2-TP3-	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	131	MOD3-DATIO21
TSN-ETH3-TP2+	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	132	MOD3-DATIO22
TSN-ETH3-TP2-	N/C Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point (N/	134	MOD2-DATIO29		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	135	MOD2-DATIO30		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	137	MOD2-DATIO17		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	138	MOD2-DATIO18		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	139	MOD3-DATIO11
TSN-ETH2-TP1+	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	140	MOD3-DATIO12
TSN-ETH2-TP1-	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	141	MOD3-DATIO03
TSN-ETH1-TP1+	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	142	MOD3-DATIO04
TSN-ETH1-TP1-	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	143	MOD2-DATIO25		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	144	MOD2-DATIO26		FM9
	n/c FM9 SATA Solid State Drive (SSD) Module; 1.92 TB TLC	146	MOD3-DATIO06
TSN-ETH1-TP2-	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	147	MOD3-DATIO05
TSN-ETH1-TP2+	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	148	MOD3-DATIO07
TSN-ETH1-TP3+	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	149	MOD3-DATIO08
TSN-ETH1-TP3-	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	150	MOD3-DATIO01
TSN-ETH1-TP0+	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point	151	MOD3-DATIO02
TSN-ETH1-TP0-	Single Channel, Dual-Redundant Ports, TSN, IEEE 802.1AS, End Point		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		(N/A, ETH, if configured)
	N/A		MOD1-DATIO31
	12 Ch. ±10 VDC or ± 25 mA / Ch.		MOD1-DATIO32
	12 Ch. ±10 VDC or ± 25 mA / Ch.		MOD1-DATIO33
	N/C		MOD1-DATIO34
	N/C		MOD1-DATIO35
	N/C		MOD1-DATIO36
	N/C		MOD1-DATIO37
	N/C		MOD1-DATIO38
	N/C		MOD1-DATIO39
	N/C		MOD1-DATIO40
	N/C		N/C (+5V-USB-)
	N/C		N/C (ETH1-RXN)
	N/C		N/C (ETH1-RXP)
	N/C		N/C (ETH1-TXN)
	N/C		N/C (ETH1-TXP)
	N/C		N/C (ETH2-RXN)
	N/C		N/C (ETH2-RXP)
	N/C		N/C (ETH2-TXN)
	N/C		N/C (ETH2-TXP)
	N/C		N/C (-USB-DM)
	N/C		N/C (-USB-DP)
	N/C		N/C (USB-GND-)
	N/C
	N/C
	N/C
	N/C
	(N/A)
	(N/A)
	N/C
	N/C

General System Functions

PS-ON/OFF#

SIU32S PSU is strapped to be always “ON”. The unit will power-on if external +28V power is applied.

SYSRST#

[GND] or Logic-level “Low” (referenced to internal System GND of the SIU32S) initiates/applies an active low assertion to the OpenVPX SYSRST# signal on the cards. Applied and once released, this will effectively introduce a root ‘system/card’ reset. SYSRST# signal is typically accessed from the SLOT-1 card, J1 MIL-connector.

Note

SYSRST# function is dependent on slot 1 card type/configuration; SYSRST# is typically routed to the “MRSTn” reset input of the SBC (root-complex) /Slot-1 card. If/as applicable, the card issues the RSTn signal on the backplane to all other “end-point” cards within the chassis when SYSRST# is asserted.

Note

The +28VDC power return, system signal ground, and chassis ground are electrically isolated from each other by a minimum of 1 MΩ.

PART NUMBER DESIGNATION

Standard Product = SIU32S-XXXXX

XXXXX = NAI/Factory assigned unique configuration identifier

Standard Product = SIU32S-XXXXX

Chassis Family	SIU32S
Chassis Version	XXXXX
- Standard 3U OpenVPX 2-slot card version (plus dedicated PSU slot). - Pre-Configured Card, Function, Slot Designation and PSU Definitions*. - Unique product specific configuration code assignment / identifier. Contact factory for other than standard version**.

_Specifications are subject to change without notice._

NOTES:

*Factory assigned X-digit code will reference the complete SIU configuration information in the NAI Master Code List (MCL) or Part Number Configurator, as assigned and documented at the factory.

SIU mating connector kit part number:

OpenVPX Systems; 2x 151-pin (unique keys) & 1x 13-pin 28 VDC Power: SIU32S-CONN-KIT

**If your configuration option is not listed please contact factory at 1-631-567-1100

REVISION HISTORY

Hardware Manual - SIU32S
Revision Date	Description
2025-09-22	Added power/signal/chassis ground isolation note.

NAI Cares

North Atlantic Industries (NAI) is a leading independent supplier of Embedded I/O Boards, Single Board Computers, Rugged Power Supplies, Embedded Systems and Motion Simulation and Measurement Instruments for the Military, Aerospace and Industrial Industries. We accelerate our clients’ time-to-mission with a unique approach based on a Configurable Open Systems Architecture™ (COSA®) that delivers the best of both worlds: custom solutions from standard COTS components.

We have built a reputation by listening to our customers, understanding their needs, and designing, testing and delivering board and system-level products for their most demanding air, land and sea requirements. If you have any applications or questions regarding the use of our products, please contact us for an expedient solution.

Please visit us at: www.naii.com or select one of the following for immediate assistance:

Documentation

https://www.docs.naii.com

FAQ

http://www.naii.com/faqs

Application Notes

http://www.naii.com/applicationnotes

Calibration and Repairs

http://www.naii.com/calibrationrepairs

Call Us

(631) 567-1100

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