Specifications
General for the Motherboard
| Signal Logic Level: | Supports LVDS PCIe ver. 3.0 bus (x1) |
|---|---|
| Power (Motherboard): | +12 VDC @ <1 A (est. typical) +3.3V_AUX @ <100 mA (typical) Then add power for each individual module |
| Temperature, Operating: | “C” =0° C to +70° C, “H” =-40° C to +85° C (see part number) |
| Storage Temperature: | -55° C to +105° C |
| Temperature Cycling: | Each board is cycled from -40° C to +85° C for option “H” |
| General size: Height: | 3.94” / 100 mm (3U) |
| Width: | 1.0” / 25.4 mm (5 HP) air cooled front panel options |
| Depth: | 6.3“ / 160 mm deep |
| Weight: | 21.5 oz. (610 g) unpopulated (approx.) (convection or conduction cooled) >> then add weight for each module (typically 1.5 oz. (42 g) each) |
Specifications are subject to change without notice.
Environmental
Unless otherwise specified, the following table outlines the general Environmental Specifications design guidelines for board level products of North Atlantic Industries. All our cPCI, VME and OpenVPX boards are designed for either air or conduction cooling. All boards also incorporate appropriate stiffening to ensure performance during shock and vibration but also to assure reliable operation (lower fatigue stresses) over the service life of the product.
| Parameters | Level | ||
| 1 / Commercial-AC (Air Cooled) | 2 / Rugged-AC (Air Cooled) | 3 / Rugged-CC (Conduction Cooled) | |
| Temperature – Operating | 0° C to 70° C, Ambient | -40° C to 85° C, Ambient | -40° C to 85° C, at wedge lock thermal interface |
| Temperature - Storage | -40° C to 85° C | -55° C to 105° C | -55° C to 105° C |
| Humidity – Operating | 0 to 95%, non-condensing | 0 to 95%, non-condensing | 0 to 95%, non-condensing |
| Humidity - Storage | 0 to 95%, non-condensing | 0 to 95%, non-condensing | 0 to 95%, non-condensing |
| Vibration – Sine | 2 g peak, 15 Hz – 2 kHz | 6 g peak, 15 Hz – 2 kHz | 10 g peak, 15 Hz – 2 kHz |
| Vibration – Random | .002 g /Hz, 15 Hz – 2 kHz | 0.04 g /Hz, 15 Hz – 2 kHz | 0.1 g /Hz, 15 Hz – 2 kHz |
| Shock | 20 g peak, half-sine, 11 ms | 30 g peak, half-sine 11 ms | 40 g peak, half-sine, 11 ms |
| Low Pressure | Up to 15,000 ft. | Up to 50,000 ft. | Up to 50,000 ft. |
Notes:
A. Based on sweep duration of ten minutes per axis on each of the three mutually perpendicular axes. B. Displacement limited to 0.10 D.A. from 15 to 44 Hz. C. Displacement limited to 0.436 D.A. from 15 to 21 Hz. D. 60 minutes per axis on each of the three mutually perpendicular axes. E. Per MIL-STD-810G, Method 5.14.6 Procedure I, Fig.514.6C-6 Category 7 tailored (11.65 Grms): 15 Hz – 2 kHz; ASD (PSD) at 0.04 g2/Hz between 15 Hz - 150 Hz, increasing @ 4 dB/octave from 0.04 g2/Hz to 0.1 g /Hz between 150 Hz – 300 Hz, 0.1 g2/Hz between 300 Hz - 1000 Hz, decreasing @ 6 dB/octave from 0.1 g2/Hz to 0.025 g2/Hz between 1000 Hz – 2000 Hz. Three hits per direction per axis (total of 18 hits). F. Three hits per direction per axis (total of 18 hits). G. For altitudes higher than 50,000 ft., contact NAI. H. High temperature operation requires 350 lfm minimum air flow across cover/heatsink (module dependent). I. High temperature operation requires 600 lfm minimum air flow across cover/heatsink (module dependent).
Specifications subject to change without notice